@conference{conference,
  author = {Gheorghe Stan and Yvonne Gerbig and Nicolas Alderete and Paresh Daharwal and Cristian Victor Ciobanu},
  title = {Multiscale Mechanical Characterization of Hybrid-Bonding Copper: From Instrumented Indentation to AFM},
  year = {2026},
  month = {2026-06-17 04:06:00},
  publisher = {The 2026 IEEE 76th Electronic Components and Technology Conference, Orlando, FL, US},
  url = {https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=961486},
  doi = {https://doi.org/10.1109/ECTC51846.2026.00127},
  language = {en},
}