@article{1293526,
  author = {Trevor Braun and Daniel Josell and Thomas Moffat},
  title = {Simulating Cu Electrodeposition in High Aspect Ratio Features: Effect of Control Mode and Uncompensated Resistance in S-NDR Systems},
  year = {2021},
  month = {2021-02-15 05:02:00},
  publisher = {Electrochimica Acta},
  url = {https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=931716},
  language = {en},
}