@article{1289516,
  author = {Ran Tao and Polette Centellas and Stian Romberg and Anthony Kotula and Gale Holmes and Amanda Forster and Christopher Soles and Bob Allen and Edvin Cetegen and William Chen and Jeff Gotro and Mark Poliks},
  title = {Material Needs and Measurement Challenges for Advanced Semiconductor Packaging: Understanding the Soft Side of Science},
  year = {2025},
  month = {2025-08-27 04:08:00},
  publisher = {IEEE Transactions on Components, Packaging and Manufacturing Technology},
  url = {https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=959970},
  doi = {https://doi.org/10.1109/TCPMT.2025.3603484},
  language = {en},
}