@conference{103191,
  author = {Jan Obrzut},
  title = {Compensation of Thermal Expansiveness In Plastic DCA-Flip-Chip Assemblies Using A Mechanically Compliant Dielectric},
  year = {1999},
  month = {1999-05-03},
  publisher = {IMAPS International Advanced Technology Workshop on Flip Chip Technology, Braselton, GA},
  url = {https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=851554},
  language = {en},
}