Mandatory concept papers for this funding opportunity were due on April 12, 2024.
Concept papers received after this deadline will not be reviewed or considered.
Due to overwhelming demand for this funding opportunity, the merit review period has been extended. Review of concept papers and feedback to applicants is expected to completed on or about May 21, 2024.
Please visit the CHIPS R&D funding page for information on other opportunities.
On February 28, 2024, CHIPS for America issued a Notice of Funding Opportunity (NOFO) to seek applications for research and development (R&D) activities that will establish and accelerate domestic capacity for advanced packaging substrates and substrate materials, a key technology for manufacturing semiconductors. The CHIPS for America program anticipates approximately $300 million in funding innovation across multiple technologies ranging from semiconductor-based to glass and organics. This is the first NOFO released by the CHIPS for America R&D program office, and the third NOFO released overall by CHIPS for America.
Read the full text of the funding opportunity (PDF) for more information.
FAQ: CHIPS R&D Research Security and Technology Protection (PDF)
FAQ: International Engagement in CHIPS R&D Programs (PDF)
Additional Frequently Asked Questions
CHIPS Technology Protection Guidebook (PDF)
CHIPS R&D Commercial Viability and Domestic Production (CVDP) Plan Guidebook (PDF)
Read more on the vision for the CHIPS NAPMP.
Through this NOFO, the NAPMP program seeks to achieve the following objectives:
Mandatory Concept Paper: Applicants will be asked to submit a concept paper. Concept papers were due on April 12, 2024.
Full Application Process: Full proposals are due July 3, 2024.
Learn about additional CHIPS for America R&D funding opportunities.