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Directed Electroless Deposition of Metals on Thiol Modified Au Using Microcontact Printing


Chris Zangmeister and Roger van Zee


Process Measurements Division, Chemical Science and Technology Laboratory

National Institute of Standards and Technology, Gaithersburg, MD 20899


Directed deposition of metals on surfaces is being investigated for potential use in the formation of a covalently bonded top contact for molecular electronic applications. Such contacts may be formed by the coordination of metals in solution utilizing traditional electroless plating.  This study focuses on the modification of model molecular electronic species to direct the deposition of Cu.  This result is obtained by thiol modified Au substrates and microcontact printing (mCP) of the desired molecules.  4-mercaptobenzoic acid (4-MBA), a model for molecular electronic compounds, was used to direct the deposition of Cu.  After patterning, copper is preferentially deposited on the 4-MBA modified region of the surface. These patterned surfaces are studied using Fourier transform infrared spectroscopy (FTIR), and optical, atomic force, and scanning electron microscopies.