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Displaying records 71 to 80 of 396 records.
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71. Spin transport parameters in metallic multilayers determined by ferromagnetic resonance measurements of spin-pumping
Topic: Materials Science
Published: 4/19/2013
Authors: Carl Thomas Boone, Hans Toya Nembach, Justin M Shaw, Thomas J Silva
Abstract: We measured spin-transport in nonferromagnetic (NM) metallic multilayers from the contribution to damping due to spin pumping from a ferromagnetic Co^d90^Fe^d10^ thin film. The multilayer stack consisted of NM^d1^/NM^d2^/Co^d90^Fe^d10^(2 nm)/NM^d2^/N ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=912988

72. Determining Mechanical Reliability of Brittle Materials
Topic: Materials Science
Published: 4/18/2013
Authors: Stephen W. Freiman, Jeffrey T Fong
Abstract: The widespread existence of slow crack growth in most glasses and ceramics due to a stress-enhanced reaction between an external environment and strained bonds at a crack tip greatly complicates the challenge of assuring the reliability of components ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=910158

73. The evaluation of photo/e-beam complementary grayscale lithography for high topography 3D structure
Topic: Materials Science
Published: 3/29/2013
Authors: Liya Yu, Richard J Kasica, Robert Dennis Newby, Lei Chen, Vincent K Luciani
Abstract: This article demonstrates and evaluates photo/e-beam grayscale complementary lithography processes for the fabrication of large area, high topography grayscale structure. The combination of these two techniques capitalizes on the capability of photol ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=913677

74. Integrating carbon nanotubes as vias in a monolithic 3DIC process
Topic: Materials Science
Published: 3/21/2013
Authors: Ann Chiaramonti Chiaramonti Debay, Sten Vollebregt, R. Ishihara, Johan van der Cingel , Kees Beenakker
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=911494

75. Towards the Integration of Carbon Nanotubes as Vias in Monolithic 3D Integrated Circuits
Topic: Materials Science
Published: 3/21/2013
Authors: Ann Chiaramonti Chiaramonti Debay, Sten Vollebregt, Johan van der Cingel , Kees Beenakker, R. Ishihara
Abstract: Carbon nanotubes (CNT) can be an attractive candidate for vertical interconnects (vias) in 3D integrated circuits due to their excellent thermal and electrical properties. To investigate CNT electrical resistivity, test vias were fabricated using b ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=912413

76. Benefits and Costs of Energy Standard Adoption in New Commercial Buildings: Midwest Census Region
Series: Special Publication (NIST SP)
Report Number: 1148-2
Topic: Materials Science
Published: 3/5/2013
Author: Joshua D Kneifel
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=912979

77. Benefits and Costs of Energy Standard Adoption in New Commercial Buildings: Northeast Census Region
Series: Special Publication (NIST SP)
Report Number: 1148-1
Topic: Materials Science
Published: 3/5/2013
Author: Joshua D Kneifel
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=912978

78. Benefits and Costs of Energy Standard Adoption in New Commercial Buildings: South Census Region
Series: Special Publication (NIST SP)
Report Number: 1148-3
Topic: Materials Science
Published: 3/5/2013
Author: Joshua D Kneifel
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=912980

79. Benefits and Costs of Energy Standard Adoption in New Commercial Buildings: West Census Region
Series: Special Publication (NIST SP)
Report Number: 1148-4
Topic: Materials Science
Published: 3/5/2013
Author: Joshua D Kneifel
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=913157

80. POROMECHANICS OF THIN WATER PURIFICATION MEMBRANE LAYERS
Topic: Materials Science
Published: 3/3/2013
Authors: Edwin P Chan, Christopher M Stafford, Allison P Young
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=913307



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