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You searched on: Topic Area: Materials Science

Displaying records 51 to 60 of 441 records.
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51. Safety and Performance Standard Developments for Automated Guided Vehicles
Topic: Materials Science
Published: 7/23/2014
Authors: Roger V Bostelman, Tsai Hong Hong, Roger D. Eastman
Abstract: The American National Standards Institute/Industrial Truck Standards Development Foundation (ANSI/ITSDF) B56.5 Safety Standard committee for automated guided vehicles (AGVs) has been considering several changes to improve the standard. Of interest t ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=915310

52. Superconducting nanowire single photon detectors fabricated from an amorphous Mo0.75Ge0.25 thin-film
Topic: Materials Science
Published: 7/15/2014
Authors: Varun Boehm Verma, Adriana E Lita, Michael R Vissers, Francesco Marsili, David P Pappas, Richard P Mirin, Sae Woo Nam
Abstract: We present the characteristics of superconducting nanowire single photon detectors (SNSPDs) fabricated from amorphous Mo0.75Ge0.25 thin -films. Fabricated devices show a saturation of the internal detection efficiency at temperatures below 1 K, w ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=915243

53. From atoms to steps: the microscopic origins of crystal growth.
Topic: Materials Science
Published: 7/1/2014
Authors: Paul N Patrone, T L Einstein, Dionisios Margetis
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=914829

54. Non-destructive Measurement of the Residual Stresses in Copper Through-Silicon Vias using Synchrotron Based Micro-beam X-ray Diffraction
Topic: Materials Science
Published: 7/1/2014
Authors: Chukwudi Azubuike Okoro, Lyle E Levine, Yaw S Obeng, Klaus Hummler, Ruqing Xu
Abstract: In this study, we report a new method for achieving depth resolved determination of the full stress tensor in buried Cu through-silicon vias (TSVs), using synchrotron based X-ray micro-diffraction technique. Two adjacent Cu TSVs were analyzed; on ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=915348

55. Synchrotron-Based Measurement of the Impact of Thermal Cycling on the Evolution of Stresses in Cu Through-Silicon Via
Topic: Materials Science
Published: 6/30/2014
Authors: Chukwudi Azubuike Okoro, Lyle E Levine, Ruqing Xu, Klaus Hummler, Yaw S Obeng
Abstract: One of the main causes of failure during the lifetime of microelectronics devices is their exposure to fluctuating temperatures. In this work, synchrotron-based X-ray micro-diffraction is used to study the evolution of stresses in copper through-sili ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=915982

56. Uncertainty Quantification in Materials Modeling
Topic: Materials Science
Published: 6/24/2014
Authors: Andrew M Dienstfrey, Ronald F Boisvert, Frederick R Phelan Jr., Fadil Santosa, Alejandro Strachan, Stephen Christensen
Abstract: N/A
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=915816

57. Defect and Microstructural Evolution in Thermally Cycled Cu Through-Silicon Vias
Topic: Materials Science
Published: 6/14/2014
Authors: Chukwudi Azubuike Okoro, James Marro, Yaw S Obeng, Kathleen Richardson
Abstract: In this study, the effect of thermal cycling on defect generation, microstructure, and the RF signal integrity of blind Cu through-silicon via (TSV) were investigated. Three different thermal cycling profiles were used; each differentiated by their ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=915535

58. Spray-deposition and photopolymerization of organic-inorganic thiol-ene resins for fabrication of superamphiphobic surfaces
Topic: Materials Science
Published: 6/9/2014
Authors: Li Xiong, Laken Kendrick, Hannele Heusser, Bradley J Sparks, Christopher M Stafford, James T Goetz, Sergei Nazarenko, Derek L Patton
Abstract: Superamphiphobic surfaces, exhibiting high contact angles and low contact angle hysteresis to both water and low surface tension liquids, have attracted a great deal of attention in recent years due to the importance in many practical application ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=916030

59. Control Fusion for Safe Multi-robot Coordination
Topic: Materials Science
Published: 5/9/2014
Authors: Roger V Bostelman, Jeremy A Marvel
Abstract: Future smart manufacturing systems will include more complex coordination of mobile manipulators (e.g., robot arms mounted on mobile bases). The National Institute of Standards and Technology, Performance of Collaborative Robot Systems Project has b ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=915915

60. Measuring Organelle Shape in 3D in Stem Cells Cultured on Nanofiber Scaffolds
Topic: Materials Science
Published: 4/19/2014
Authors: Carl George Simon Jr., Peter Bajcsy, Wojtek J Tutak, Jyotsnendu J. Giri
Abstract: Previous work has demonstrated that culture of osteoprogenitor cells on nanofiber scaffolds can potentiate osteogenic differentiation [1-4]. Culture of cells in nanofiber scaffolds causes changes to cell morphology, suggesting that morphological ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=914995



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