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21. Obstacle Detection and Avoidance from an Automated Guided Vehicle
Topic: Manufacturing
Published: 9/18/2014
Authors: Roger V Bostelman, William P Shackleford, Geraldine S Cheok
Abstract: Current automated guided vehicle (AGV) technology typically provides material handling flow along single or dual opposing-flow lanes in manufacturing and distribution facilities. An AGV stops for most any obstacle that may be in its path which then ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=915448

22. Collaborative Robotics: A Gateway into Factory Automation
Topic: Manufacturing
Published: 9/3/2014
Author: Jeremy A Marvel
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=916485

23. New AGV Capabilities are Safety Driven
Topic: Manufacturing
Published: 9/3/2014
Authors: Roger V Bostelman, William P Shackleford
Abstract: Current automated guided vehicle (AGV) technology typically provides material handling flow along single or dual opposing-flow lanes in manufacturing and distribution facilities. An AGV stops for most any obstacle that may be in its path which then s ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=917359

24. Performance Metrics for Evaluating Object and Human Detection and Tracking Systems
Series: NIST Interagency/Internal Report (NISTIR)
Report Number: 7972
Topic: Manufacturing
Published: 7/31/2014
Authors: Afzal A Godil, Roger V Bostelman, William P Shackleford, Tsai Hong Hong, Michael O Shneier
Abstract: In this report, we provide an overview of various performance evaluation metrics for object detection and tracking for robot safety applications in smart manufacturing. We present four different types of performance evaluation metrics based on detect ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=914820

25. Safety and Performance Standard Developments for Automated Guided Vehicles
Topic: Manufacturing
Published: 7/23/2014
Authors: Roger V Bostelman, Tsai Hong Hong, Roger D. Eastman
Abstract: The American National Standards Institute/Industrial Truck Standards Development Foundation (ANSI/ITSDF) B56.5 Safety Standard committee for automated guided vehicles (AGVs) has been considering several changes to improve the standard. Of interest t ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=915310

26. Non-destructive Measurement of the Residual Stresses in Copper Through-Silicon Vias using Synchrotron Based Micro-beam X-ray Diffraction
Topic: Manufacturing
Published: 7/1/2014
Authors: Chukwudi Azubuike Okoro, Lyle E Levine, Yaw S Obeng, Klaus Hummler, Ruqing Xu
Abstract: In this study, we report a new method for achieving depth resolved determination of the full stress tensor in buried Cu through-silicon vias (TSVs), using synchrotron based X-ray micro-diffraction technique. Two adjacent Cu TSVs were analyzed; on ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=915348

27. The stability of milling: an impact oscillator with delay
Topic: Manufacturing
Published: 6/20/2014
Authors: Matthew A Davies, Tony Schmitz, Timothy J Burns
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=915737

28. Effects of Temperature on Surface Accumulation and Release of Silica Nanoparticles in an Epoxy Nanocoating Exposed to UV Radiation
Topic: Manufacturing
Published: 6/16/2014
Authors: Chun-Chieh Tien, Ching-Hsuan Chang, Bernard Hao-Chih Liu, Deborah L Stanley, Savelas A Rabb, Lee Lijian Yu, Tinh Nguyen, Li Piin Sung
Abstract: Polymer nanocoatings are increasingly used outdoors and in harsh environments. However, because most common polymers degraded by the weathering elements, nanoparticles in polymer nanocoatings may be released into the environments. Such nanoparticle r ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=915955

29. Defect and Microstructural Evolution in Thermally Cycled Cu Through-Silicon Vias
Topic: Manufacturing
Published: 6/14/2014
Authors: Chukwudi Azubuike Okoro, James Marro, Yaw S Obeng, Kathleen Richardson
Abstract: In this study, the effect of thermal cycling on defect generation, microstructure, and the RF signal integrity of blind Cu through-silicon via (TSV) were investigated. Three different thermal cycling profiles were used; each differentiated by their ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=915535

30. Uncertainty in Measurement of the Maximum Cutting Tool Temperature by Infrared Thermography
Topic: Manufacturing
Published: 6/13/2014
Authors: Brandon M Lane, Eric Paul Whitenton, Viswanathan Madhavan, M Alkan Donmez
Abstract: This paper presents an analysis of the uncertainty in measurement of the peak temperature on the side face of a cutting tool by infrared thermography. An analytical method uses the temperature measurement equation to study the uncertainty arising f ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=915534



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