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Topic Area: Manufacturing

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Displaying records 961 to 970 of 1000 records.
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961. Strategy for Faster Blind Reconstruction of Tip Geometry for Scanned Probe Microscopy
Topic: Manufacturing
Published: 6/1/1998
Author: John S Villarrubia
Abstract: In scanned probe microscopy, it is necessary to know the tip's geometry in order to correct image distortions due to its finite size. Heretofore, methods have focused upon determining the tip shape by erosion of a tip characterizer of known geometry ...

962. Toward a Unified Advanced CD-SEM Specification for Sub 0.18 Micrometer Technology
Topic: Manufacturing
Published: 6/1/1998
Authors: J Allgair, C Archie, W Banke, H Bogardus, J Griffith, H Marchman, Michael T Postek, L Saraf, J Schlesinger, B Singh, N. Sullivan, L Trimble, Andras Vladar, A Yanof
Abstract: The stringent critical dimension (CD) control requirements in cutting edge device facilities have placed significant demands on metrologists and upon the tools they use. We are developing a unified, advanced critical dimension scanning electron micro ...

963. Inverse Electron Beam Modeling and Metrology Research
Topic: Manufacturing
Published: 4/1/1998
Authors: Michael T Postek, Andras Vladar, J R. Lowney, Robert D. Larrabee, William J. Keery

964. Simulation and Measurement of Subsurface Features in Scanning Electron Microscopy Metrology
Topic: Manufacturing
Published: 4/1/1998
Authors: J R. Lowney, Michael T Postek, Samuel N Jones, S Mayo, Michael W Cresswell

965. Summary Report of NIST/MSC Workshop on Traceability in Length
Series: NIST Interagency/Internal Report (NISTIR)
Report Number: 6149
Topic: Manufacturing
Published: 4/1/1998
Author: Dennis A Swyt
Abstract: The National Institute of Standards and Technology, in conjunction with the Measurement Science Conference, conducted an industry-needs workshop on February 4, 1998, on issues with U.S. manufacturing companies, particularly smaller ones, may have in ...

966. The Estimation of Measurement Uncertainty of Small Circular Features Measured by Coordinate Measuring Machines
Topic: Manufacturing
Published: 4/1/1998
Authors: Steven David Phillips, Bruce R. Borchardt, William Tyler Estler, J Buttress
Abstract: This paper examines the measurement uncertainty of small circular features as a function of the sampling strategy; i.e., the number and distribution of measurement points. Specifically, we examine measuring a circular feature using a three-point samp ...

967. Final Report, 1997-1998 NIST/SEMATECH Collaboration for Improvement of High-Accuracy Critical-dimension Metrology for Semiconductor Manufacturing
Topic: Manufacturing
Published: 3/30/1998
Authors: Andras Vladar, Michael T Postek
Abstract: Beginning on or about April 1, 1997, the National Institute of Standards and Technology (NIST) received partial support from SEMATECH to collaborate in a program designated 1997-1998 NIST/SEMATECH Collaboration for Improvement of High-Accuracy Critic ...

968. Analytical/Experimental Study of Vibration of a Room-Sized Airspring-Supported Slab
Topic: Manufacturing
Published: 3/1/1998
Authors: H Amick, B Sennewald, E Clayton Teague, Brian R Scace
Abstract: This paper reports the results of the finite element analysis and in-situ testing of a large-scale (4 m x 10 m) pneumatically isolated concrete slab are reported. The slab was constructed as a design prototype for next generation metrology laboratori ...

969. Influence of Data Analysis and Other Factors on the Short-term Stability of Vertical Scanning-Probe Microscope Calibration Measurements
Topic: Manufacturing
Published: 3/1/1998
Authors: H Edwards, J Jorgensen, John A. Dagata, Y Strausser, J Schneir
Abstract: We report a study of a fundamental limit to the accuracy of vertical measurements made using scanning-probe microscopes (SPM): the short-term stability of a vertical calibration using a waffle-pattern artifact. To test the instrumental component of t ...

970. Round Robin Determination of Power Spectral Densities of Different Si Wafer Surfaces
Topic: Manufacturing
Published: 3/1/1998
Authors: Egon Marx, I J Malik, Y Strausser, T Bristow, N Poduje, J C Stover
Abstract: Power spectral densities (PSDs) were used to characterize a set of surfaces over a wide range of lateral as well as perpendicular dimensions. Twelve 200-mm-diameter Si wafers were prepared and the surface finishes ranged from as-ground wafers to epit ...

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