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Topic Area: Manufacturing

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31. A Detailed Failure Analysis Examination of the Effect of Thermal Cycling on Cu TSV Reliability
Topic: Manufacturing
Published: 1/1/2014
Authors: Chukwudi Azubuike Okoro, June Waiyin Lau, Yaw S Obeng, Klaus Hummler
Abstract: In this work, a detailed failure analysis of the physical root cause for the increase in electrical resistance and radio-frequency (RF) transmission coefficient of through-silicon via (TSV) daisy chain was investigated. Six different failure modes we ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=913115

32. Uncertainty of temperature measurements by infrared thermography for metal cutting applications
Topic: Manufacturing
Published: 12/31/2013
Authors: Brandon M Lane, Eric Paul Whitenton, Viswanathan Madhavan, M Alkan Donmez
Abstract: This paper presents the methodology and results of a comprehensive measurement uncertainty analysis for infrared thermography of a cutting tool during the metal cutting process. The analysis is based on a commercial off-the-shelf (COTS) camera, ty ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=913632

33. Developmental validation of the PowerPlex 21 System.
Topic: Manufacturing
Published: 12/24/2013
Authors: Carolyn R Hill, Martin G. Ensenberger, Robert S. McLaren, Cynthia J. Sprecher, Douglas R. Storts
Abstract: The PowerPlex(®) 21 System is a STR multiplex that has been optimized for casework samples while still being capable of database workflows including direct amplification. The loci included in the multiplex offer increasing overlap with core loci ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=916143

34. A Simulated Sensor-based Approach for Kit Building Applications
Topic: Manufacturing
Published: 12/20/2013
Authors: Zeid Kootbally, Craig I Schlenoff, Theodore J Weisman, Stephen B. Balakirsky, Thomas Rollin Kramer, Anthony Pietromartire
Abstract: Kit building or kitting is a process in which individually separate but related items are grouped, packaged, and supplied together as one unit (kit). This paper describes advances in developing sensing/control and parts detection technologies enablin ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=914962

35. Back-End-of-Line Test Structure Design and Simulation for Subsurface Metrology with Scanning Probe Microscopy
Topic: Manufacturing
Published: 12/13/2013
Authors: Lin You, Emily Hitz, Jungjoon Ahn, Yaw S Obeng, Joseph J Kopanski
Abstract: As demands in the semiconductor industry call for further miniaturization and performance enhancement of electronic systems, the traditional planar (2D) electronic interconnection and packaging technologies show their difficulties in meeting the ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=915013

36. Additive Manufacturing Technical Workshop Summary Report
Series: Technical Note (NIST TN)
Report Number: 1823
Topic: Manufacturing
Published: 12/4/2013
Authors: Christopher U Brown, Joshua Lubell, Robert R Lipman
Abstract: This report summarizes the presentations, discussions, and recommendations from the Additive Manufacturing Technical Workshop held during the PDES, Inc. offsite meeting in Gaithersburg, Maryland in March of 2013. The purpose of the workshop was to ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=914642

37. Componentization in the Systems Modeling Language
Topic: Manufacturing
Published: 11/20/2013
Author: Conrad E Bock
Abstract: This paper describes new capabilities in the Systems Modeling Language that reduce the complexity of specifying systems through componentization, and increase the range of systems that can be specified. Modelers can identify portions of component ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=911921

38. Toward the Ideal of Automating Production Optimization
Topic: Manufacturing
Published: 11/15/2013
Authors: John L Michaloski, Frederick M Proctor, Jorge Arinez, Jonatan Berglund
Abstract: The advent of improved factory data collection offers a prime opportunity to continuously study and optimize factory operations. Although manufacturing optimization tools can be considered mainstream technology, most U.S. manufacturers do not take fu ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=914707

39. Proposed E57.02 Range Measurement Performance Standard for Medium Range 3D Imaging Systems
Topic: Manufacturing
Published: 11/11/2013
Authors: David MacKinnon, Luc Cournoyer, Kamel Shawki Saidi, Geraldine S Cheok, Robert Bridges, Darin Ingimarson
Abstract: We present the proposed standard ASTM E57.02 "Test Method to Evaluate the Range Measurement Performance of 3D Imaging Systems in the Medium Range" (Work Item ASTM WK12373). The stated purpose of the standard is to provide metrics and procedures to e ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=914811

40. Dielectrophoretic Trapping of P19 Cells on Indium Tin Oxide based Microelectrode Arrays
Topic: Manufacturing
Published: 11/8/2013
Authors: Aveek Gangopadhyay, Saugandhika Minnikanti, Darwin R Reyes-Hernandez, Mulpuri V. Rao, Nathalia Peixoto
Abstract: A microfabricated device comprised of a microelectrode array (MEA) and a microfluidic channel is presented here for the purpose of trapping cells using positive dielectrophoresis (DEP). Transparent indium tin oxide (ITO) electrodes are patterned in a ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=914569



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