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You searched on: Topic Area: Electronics Telecommunications

Displaying records 91 to 100 of 317 records.
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91. A Design Framework for High-Density Wireless Ad Hoc Networks Achieving Cooperative Diversity
Topic: Electronics & Telecommunications
Published: 5/24/2010
Authors: Hamid Gharavi, Bin Hu
Abstract: In this paper, we present a systematic design structure for high-density ad hoc networks aimed at achieving full cooperative diversity, based on which the PHY, MAC and Network layers of the system are specifically tailored. For the latter in particul ...

92. Chirp characterization of external modulators with finite extinction ratio using linear optical sampling
Topic: Electronics & Telecommunications
Published: 5/1/2010
Authors: Tasshi Dennis, Paul A Williams
Abstract: We demonstrate a network monitoring technique for the frequency chirping of external modulators based on linear optical sampling. We present α parameter waveforms of digital data modulation from simultaneously measured amplitude and phase. Digit ...

93. NIR Single photon detectors with up-conversion technology and its applications in quantum communication systems
Topic: Electronics & Telecommunications
Published: 4/15/2010
Authors: Xiao Tang, Lijun Ma, Oliver T Slattery

94. Structural and Electrical Characterization of Flip Chip Laminated omega-functionalized thiols
Topic: Electronics & Telecommunications
Published: 4/15/2010
Authors: Mariona Coll Bau, Oana Jurchescu, Nadine Emily Gergel-Hackett, Curt A Richter, Christina Ann Hacker

95. Challenges and Opportunities of Organic Electronics
Topic: Electronics & Telecommunications
Published: 4/2/2010
Author: Calvin Chan

96. Organic Electronics: Challenges and Opportunities
Topic: Electronics & Telecommunications
Published: 3/31/2010
Author: Calvin Chan

97. Engineered Microfluidic and Nanofluidic Device Metrology
Topic: Electronics & Telecommunications
Published: 3/22/2010
Author: Samuel M Stavis

98. Molecular devices made by Flip-chip lamination
Topic: Electronics & Telecommunications
Published: 3/21/2010
Authors: Christina Ann Hacker, Mariona Coll Bau, Curt A Richter

99. Flip Chip Lamination Approach to Fabricate Top Metal Contacts on Organic-based Devices
Topic: Electronics & Telecommunications
Published: 3/15/2010
Authors: Mariona Coll Bau, Oana Jurchescu, Nadine Emily Gergel-Hackett, Curt A Richter, Christina Ann Hacker
Abstract: Flip Chip Lamination approach to fabricate top metal contacts on organic-based devices ; M.Coll, O.D. Jurchescu, N. Gergel-Hackett, C.A. Richter, C,A, Hacker, American Physical Society (APS), March 2010, Portland, OR, USA (oral)

100. Interoperability Test of IEEE 1451.5 Standard-Based Wireless Sensors
Topic: Electronics & Telecommunications
Published: 3/13/2010
Authors: Kang B Lee, Yuyin Song
Abstract: The Institute of Electrical and Electronics Engineers (IEEE) 1451 standard provides plug-and-play capability of smart transducers (sensors and actuators). Plug-and-play is an important aspect of interoperability, which is the ability of two or more s ...

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  • SP 250-XX: Calibration Services
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