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Topic Area: Electronics
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Displaying records 91 to 100 of 722 records.
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91. Passive Intermodulation due to Self-Heating in Printed Transmission Lines*
Topic: Electronics & Telecommunications
Published: 2/2/2011
Authors: Eduard Rocas, Juan C. Collado Gomez, Nathan Daniel Orloff, Jordi Mateu, James C Booth, Juan M. O'Callaghan, Alberto Padilla
Abstract: Abstract,This article proposes a mechanism by which third-order intermodulation distortion due to self-heating is generated in transmission lines. The work shows how transmission lines made of several materials whose properties are independent of the ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=906027

92. Fabrication of silicon-based Molecular Electronic Structures Using Flip Chip Lamination
Topic: Electronics & Telecommunications
Published: 1/19/2011
Authors: Christina Ann Hacker, Michael A Walsh, Mariona Coll Bau, Curt A Richter
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=908430

93. GMPs: The Other Pieces of The Puzzle
Topic: Electronics & Telecommunications
Published: 1/1/2011
Authors: Melissa Meaney Phillips, Catherine A Rimmer, Laura J Wood, Paula Brown
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=907516

94. Nanofabrication Techniques for Controlled Drug Released Devices
Topic: Electronics & Telecommunications
Published: 1/1/2011
Authors: Lei Chen, Gerard Henein, Vincent K Luciani
Abstract: New drugs and delivery systems have undergone a rapid development in recent years for treating cancer, HIV aids, diseased organs, damaged nerves to relieve pain, prevent disease and restore health to human beings. The application of nanofabrication i ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=907280

95. Recommendation for Password-Based Key Derivation Part I: Storage Applications
Series: Special Publication (NIST SP)
Report Number: 800-132
Topic: Electronics & Telecommunications
Published: 12/22/2010
Authors: Meltem Sonmez Turan, Elaine B Barker, William Edward Burr, Lidong Chen
Abstract: This Recommendation specifies techniques for the derivation of master keys from passwords or passphrases to protect stored electronic data or data protection keys.
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=907381

96. Effect of resist on the transfer of line-edge roughness spatial metrics from mask to wafer
Topic: Electronics & Telecommunications
Published: 11/11/2010
Authors: Patrick P Naulleau, Gregg M. Gallatin
Abstract: Mask contributors to line-edge roughness (LER) have recently been shown to be an issue of concern for both the accuracy of current resist evaluation tests as well the ultimate LER requirements for the 22 nm production node. More recently, it has been ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=905544

97. Noise-Parameter Measurements with a Reflection Type Phase Shifter
Topic: Electronics & Telecommunications
Published: 11/1/2010
Authors: Dazhen Gu, David K Walker, James Paul Randa
Abstract: We report a miniaturized phase shifter operating in the frequency range from 5 GHz to 7 GHz for noise-parameter extraction. Such a tunable solid-state unit represents a significant reduction in the size and mass as a source-pull component, compared t ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=904104

98. Intercomparison of Methods for Detecting and Characterizing Voids in Bonded Wafer Pairs
Topic: Electronics & Telecommunications
Published: 10/14/2010
Author: Richard A Allen
Abstract: The Wafer Bond Task Force of the SEMI MEMS Standards Committee has begun a round robin experiment to evaluate methods for identifying and characterizing voids in bonded wafer pairs for three-dimensional integrated circuit (3D IC) applications. Due ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=908447

99. Intercomparison of Methods for Detecting and Characterizing Voids in Bonded Wafer Pairs
Topic: Electronics & Telecommunications
Published: 10/1/2010
Authors: Richard A Allen, Andrew C. Rudack, David Thomas Read, Winthrop A. Baylies
Abstract: The Wafer Bond Task Force of the SEMI MEMS Standards Committee has begun a round robin experiment to evaluate methods for identifying and characterizing voids in bonded wafer pairs for three-dimensional integrated circuit (3D IC) applications. Due ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=906152

100. The Forms and Functions of Complex Nanofluidic Surfaces
Topic: Electronics & Telecommunications
Published: 9/14/2010
Authors: Samuel M Stavis, Elizabeth A Strychalski, Jon C Geist, Laurie E Locascio, Michael Gaitan
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=907053



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