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You searched on: Topic Area: Nanofabrication, Nanomanufacturing, and Nanoprocessing Sorted by: title

Displaying records 11 to 20 of 38 records.
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11. Flip Chip Lamination Approach to Fabricate Top Metal Contacts on Organic-based Devices
Topic: Nanofabrication, Nanomanufacturing, and Nanoprocessing
Published: 3/15/2010
Authors: Mariona Coll Bau, Oana Jurchescu, Nadine Emily Gergel-Hackett, Curt A Richter, Christina Ann Hacker
Abstract: Flip Chip Lamination approach to fabricate top metal contacts on organic-based devices ; M.Coll, O.D. Jurchescu, N. Gergel-Hackett, C.A. Richter, C,A, Hacker, American Physical Society (APS), March 2010, Portland, OR, USA (oral)
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=907069

12. Flip Chip Lamination Approach to Fabricate Ultrasmooth Metal Contacts for Organic-based Electronic Device
Topic: Nanofabrication, Nanomanufacturing, and Nanoprocessing
Published: 6/4/2010
Authors: Mariona Coll Bau, Nadine Emily Gergel-Hackett, Oana Jurchescu, Curt A Richter, Christina Ann Hacker
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=907066

13. Flip Chip Lamination to electrically contact organic single crystals on flexible substrates
Topic: Nanofabrication, Nanomanufacturing, and Nanoprocessing
Published: 4/20/2011
Authors: Oana Jurchescu, Brad Conrad, Christina Ann Hacker, David J Gundlach, Curt A Richter
Abstract: The fabrication of top metal contacts for organic electronics represents a challenge and has important consequences for electrical properties of such systems. We report a low cost and non-destructive printing process, Flip Chip Lamination (FCL), to f ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=907524

14. GaN Nanowires Grown by Molecular Beam Epitaxy
Topic: Nanofabrication, Nanomanufacturing, and Nanoprocessing
Published: 8/1/2011
Authors: Kristine A Bertness, Norman A Sanford, Albert Davydov
Abstract: The unique properties of GaN nanowires grown by molecular beam epitaxy are reviewed. These properties include the absence of residual strain, exclusion of most extended defects, long photoluminescence lifetime, low surface recombination velocity,and ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=909502

15. Guided three-dimensional catalyst folding during Metal assisted Chemical Etching of Silicon
Topic: Nanofabrication, Nanomanufacturing, and Nanoprocessing
Published: 6/28/2011
Authors: Konrad Rykaczewski, Owen J. Hildreth, Ching P. Wong, Andrei G. Fedorov, John Henry j Scott
Abstract: In order to fabricate truly complex three-dimensional (3D) silicon nanostructures fabrication methods which expand beyond the concept of creation of straight 3D structures by direct extension of two dimensional (2D) patterns need to be developed. In ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=908006

16. Hydrodynamic Fractionation of Finite Size Nano Gold Clusters
Topic: Nanofabrication, Nanomanufacturing, and Nanoprocessing
Published: 6/15/2011
Authors: De-Hao D. Tsai, Tae Joon Cho, Frank W DelRio, Julian S. Taurozzi, Michael Russel Zachariah, Vincent A Hackley
Abstract: We demonstrate a high resolution in situ experimental method for performing simultaneous size-classification and characterization of functional nanoscale gold clusters (NGCs) based on asymmetric-flow field flow fractionation (AFFF). Field emission sc ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=908232

17. Methodology for imaging of nano-to-microscale water condensation dynamics on complex nanostructures
Topic: Nanofabrication, Nanomanufacturing, and Nanoprocessing
Published: 6/11/2011
Authors: Konrad Rykaczewski, John Henry j Scott
Abstract: By transferring of a small part of a macroscale sample to a novel thermally insulated sample platform we are able to mitigate flooding and electron heating problems typically associated with Environmental Scanning Electron Microscopy imaging of water ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=908396

18. Molecular devices made by Flip-chip lamination
Topic: Nanofabrication, Nanomanufacturing, and Nanoprocessing
Published: 3/21/2010
Authors: Christina Ann Hacker, Mariona Coll Bau, Curt A Richter
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=907064

19. Nanoelectronic Fabrication with Flip Chip Lamination
Topic: Nanofabrication, Nanomanufacturing, and Nanoprocessing
Published: 12/15/2009
Authors: Mariona Coll Bau, Curt A Richter, Christina Ann Hacker
Abstract: Nanoelectronic fabrication with Flip chip lamination Mariona Coll, CA Richter, CA Hacker, Colloquium Catalan Institute of Nanoscience and Nanotechnology CIN2, Barcelona Spain, Dec 2009.
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=907070

20. Nanoelectronics Lithography
Topic: Nanofabrication, Nanomanufacturing, and Nanoprocessing
Published: 3/1/2011
Authors: Stephen Knight, Vivek M Prabhu, John H Burnett, James Alexander Liddle, Christopher L Soles, Alain C. Diebold
Abstract: This is a compiled chapter that will be included into the Handbook of Nanophysics.
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=901888



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