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Displaying records 31 to 34.
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31. Validating classical line profile analyses using microbeam diffraction from individual dislocation cell walls and cell interiors
Topic: Metals
Published: 4/1/2012
Authors: Lyle E Levine, P. Geantil, B C. Larson, Jonathan Tischler, Michael E. Kassner, Wenjun Liu
Abstract: Dislocation structures in deformed metals produce broad, asymmetric diffraction line profiles. During analysis, these profiles are generally separated into two nearly symmetric subprofiles corresponding to dislocation cell walls and cell interiors. ...

32. Workshop on Quantitative Tools for Condition Assessment of Aging Infrastructure
Series: NIST Interagency/Internal Report (NISTIR)
Topic: Metals
Published: 10/14/2010
Authors: Ward L Johnson, Thomas Allen Siewert, Jessica Terry, Dat Duthinh, Mark A Iadicola, William E Luecke, Joseph David McColskey
Abstract: The Quantitative Tools for Condition Assessment of Aging Infrastructure Workshop was held May 4-5, 2010, in Boulder, Colorado. It was organized by a team of researchers within the National Institute of Standards and Technology s (NIST) Materials Scie ...

33. X-Ray Micro-Beam Diffraction Determination of Full Stress Tensors in Cu TSVs
Topic: Metals
Published: 5/28/2013
Authors: Chukwudi Azubuike Okoro, Lyle E Levine, Oleg A Kirillov, Yaw S Obeng, Ruqing Xu, Jonathan Z Tischler, Wenjun Liu, Klaus Hummler
Abstract: We report the first non-destructive, depth resolved determination of the full stress tensor in Cu through-silicon vias (TSVs), using synchrotron based micro-beam X-ray diffraction. Two adjacent Cu TSVs were studied; one deliberately capped with SiO2, ...

34. X-Ray Micro-Beam Diffraction Measurement of the Effect of Thermal Cycling on Stress in Cu TSV: A Comparative Study
Topic: Metals
Published: 5/26/2014
Authors: Chukwudi Azubuike Okoro, Lyle E Levine, Yaw S Obeng, Klaus Hummler, Ruqing Xu
Abstract: Microelectronic devices are subjected to constantly varying temperature conditions during their operational lifetime, which can lead to their failure. In this study, we examined the impact of thermal cycling on the evolution of stresses in Cu TSVs us ...

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