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Displaying records 61 to 65.
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61. Test Results of the First US ITER TF Conductor in SULTAN
Topic: Advanced Materials
Published: 6/22/2009
Authors: Nicolai N. Martovetsky, Daniel R. Hatfield, John R. Miller, Chen-yu Gung, Joel S. Schultz, Najib Cheggour, Loren Frederick Goodrich, Pierluigi Bruzzone, Boris Stepanov, Rainer Wesche, Bernd Seeber
Abstract: The US Domestic Agency is one of six parties supplying TF cable-in-conduit conductors (CICCs) for ITER. Previous tests have shown that measured performance of the TF CICCs can be much lower than expected from the strand properties at the projected un ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=900251

62. Nanoimprint Lithography for the Direct Patterning of Nanoporous Interlayer Dielectric Insulator Materials
Topic: Advanced Materials
Published: 3/28/2008
Authors: Hyun Wook Ro, Hae-Jeong Lee, Eric K Lin, Alamgir Karim, Daniel R. Hines, Do Y. Yoon, Christopher L Soles
Abstract: Directly patterning dielectric insulator materials for semiconductor devices via nanoimprint lithography has the potential to simplify fabrication processes and reduce manufacturing costs. However, the prospect of mechanically forming these material ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=852733

63. Mechanically Robust Spin-On Organosilicates Glasses for Nanoporous Applications
Topic: Advanced Materials
Published: 2/7/2007
Authors: Hyun Wook Ro, K Char, Eun-Chae Jeon, H C Kim, Dongil Kwon, Hae-Jeong Lee, J. H. Lee, Hee-Woo Rhee, Christopher L Soles, Do Y. Yoon
Abstract: An increasing number of technologies demand nanoporous materials with vastly improved physical, mechanical and thermal properties. This manuscript develops the microstructural basis for synthesizing organosilicate glasses (OSGs) with unprecedented ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=852621

64. An Octagonal Architecture for High Strength PIT Nb^d3^Sn Conductors
Topic: Advanced Materials
Published: 6/6/2006
Authors: L. R. Motowidlo, E Barzi, D. Turrioni, Najib Cheggour, Loren Frederick Goodrich
Abstract: Powder-in-Tube (PIT) Nb^d3^Sn conductors have been fabricated utilizing a low-cost intermetallic Cu^d5^Sn^d4^ powder as the tin source. A novel octagonal PIT design that incorporates dispersion strengthened copper as well as a hexagonal PIT design w ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=900875

65. Origins of enhanced capacity retention in copolymerized sulfur - based composite cathodes for high-energy density Li-S batteries
Topic: Advanced Materials
Published: Date unknown
Authors: Vladimir Pavlovich Oleshko, Jenny J. Kim, Jennifer Lyn Schaefer, Steven D Hudson, Christopher L Soles, Adam Simmonds, Jared Griebel, Kookheon Char, Jeff Pyun
Abstract: Poly(sulfur-random-(1,3-diisopropenylbenzene) (poly(S-r-DIB)) copolymers synthesized via inverse vulcanization form high molecular mass electrochemically active polymers capable of realizing enhanced capacity retention (1005 mAh/g at 100 cycles) and ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=917921



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