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Displaying records 31 to 39.
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31. Accuracy Considerations for Critical Dimension Semiconductor Metrology
Topic: Nanomanufacturing
Published: 9/9/2008
Authors: Ronald G Dixson, Ndubuisi George Orji, B Bunday, J Allgair
Abstract: As the size of integrated circuit features continues to decrease, the accuracy of measurements becomes more important. Due to greater emphasis on precision rather than accuracy, many of the measurements made in semiconductor fabs are not traceable to ...

32. Through-focus scanning optical microscope imaging method for nano-scale dimensional analysis
Topic: Nanomanufacturing
Published: 9/1/2008
Authors: Ravikiran Attota, Richard M Silver
Abstract: We present a novel optical technique that produces nanometer dimensional measurement sensitivity using a conventional bright-field optical microscope, by analyzing two-dimensional through-focus scanning optical microscope (TSOM) images constructed us ...

33. Cellulose Nanocrystals the Next Big Nano-thing?
Topic: Nanomanufacturing
Published: 8/6/2008
Authors: Michael T Postek, Andras Vladar, John A Dagata, Natalia Farkas, Bin Ming, Ronald Sabo, Theodore H Wegner
Abstract: Biomass surrounds us from the smallest alga to the largest redwood tree. Even the largest trees owe their strength to a newly-appreciated class of nanomaterials known as cellulose nanocrystals (CNC). Cellulose, the world s most abundant natural, rene ...

34. Simulated SEM Images for Resolution Measurement
Topic: Nanomanufacturing
Published: 7/30/2008
Authors: Petr Cizmar, Andras Vladar, Bin Ming, Michael T Postek
Abstract: Resolution is a key performance metric, which often defines the quality of a scanning electron microscope (SEM). Traditionally, there is the subjective measurement of the distance between two points on special ''resolution'' samples and there are sev ...

35. High resolution full-field imaging of nanostructures using compact extreme ultraviolet lasers
Topic: Nanomanufacturing
Published: 7/21/2008
Authors: Norman A Sanford, F Brizuela, Kristine A Bertness
Abstract: Recent advances in the development of high peak brightness table-top extreme ultraviolet (EUV) and soft x-ray (SRX) lasers have opened new opportunities for the demonstration of compact full-field EUV/SXR microscopes capable of capturing images with ...

36. Optical Through-Focus Technique that Differentiates Small Changes in Line Width, Line Height and Sidewall Angle for CD, Overlay, and Defect Metrology Applications
Topic: Nanomanufacturing
Published: 4/16/2008
Authors: Ravikiran Attota, Richard M Silver, Bryan M Barnes
Abstract: We present a new optical technique for dimensional analysis of sub 100 nm sized targets by analyzing through-focus images obtained using a conventional bright-field optical microscope.  We present a method to create through-focus image maps (TFIM) us ...

37. Towards Accurate Feature Shape Metrology
Topic: Nanomanufacturing
Published: 3/22/2008
Authors: Ndubuisi George Orji, Ronald G Dixson, B Bunday, J Allgair
Abstract: Over the last few years, the need for shape metrology for process control has increased. A key component of shape metrology is sidewall angle (SWA). However, few instruments measure SWA directly. The critical dimension atomic force microscope (CD-AFM ...

38. Integration, Interoperability, and Information Management: What are the Key Issues to Nanomanufacturing?
Topic: Nanomanufacturing
Published: 9/1/2007
Author: Kevin W Lyons
Abstract: Nanomanufacturing can be defined as all manufacturing activities that collectively support an approach to design, produce, control, modify, manipulate, and assemble nanometer scale objects and features for the purpose of fabricating a product or syst ...

39. NIST's Logistics Integration Solutions
Series: Letter Circular
Topic: Nanomanufacturing
Published: 9/1/2004
Author: Sharon J. Kemmerer
Abstract: The NIST Manufacturing Interoperability Program staff has years of experience developing standards, validating solutions, and providing interoperability results in the field of manufacturing. Building on this experience, NIST can: (1) Work with indu ...

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