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Author: hui zhou
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1. Enhancing 9 nm Node Dense Patterned Defect Optical Inspection using Polarization, Angle, and Focus
Published: 4/10/2013
Authors: Bryan M Barnes, Francois Romain Francis Goasmat, Martin Yeungjoon Sohn, Hui Zhou, Abraham Arceo
Abstract: To measure the new SEMATECH 9 nm node Intentional Defect Array (IDA) and subsequent small, complex defects, a methodology has been used to exploit the rich information content generated when simulating or acquiring several images of sub-wavelength-si ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=913542

2. 3-D Optical Metrology of Finite sub-20 nm Dense Arrays using Fourier Domain Normalization
Published: 3/25/2013
Authors: Jing Qin, Hui Zhou, Bryan M Barnes, Ronald G Dixson, Richard M Silver
Abstract: Reduced target dimensions requiring improved resolution and sensitivity have driven the need to use and analyze the phase and scattered frequency information available when using image-based scatterometry systems. One such system is scatterfield micr ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=912961

3. SCATTERFIELD MICROSCOPY, REVIEW OF TECHNIQUES THAT PUSH THE FUNDAMENTAL LIMITS OF OPTICAL DEFECT METROLOGY
Published: 3/25/2013
Authors: Richard M Silver, Bryan M Barnes, Francois Romain Francis Goasmat, Hui Zhou, Martin Yeungjoon Sohn
Abstract: The semiconductor manufacturing industry is now facing serious challenges in achieving defect detection rates with acceptable throughput and accuracy. With conventional bright-field and dark- field inspection methods now at their limits, it has b ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=913246

4. Multiple-order Imaging for Optical Critical Dimension Metrology using Microscope Characterization
Published: 10/11/2012
Authors: Jing Qin, Hui Zhou, Bryan M Barnes, Francois Romain Francis Goasmat, Ronald G Dixson, Richard M Silver
Abstract: There has been much recent work in developing advanced optical metrology applications that use imaging optics for optical critical dimension (OCD) measurements, defect detection, and for potential use with in-die metrology applications. We have previ ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=912169

5. Improving optical measurement uncertainty with combined multitool metrology using a Bayesian approach
Published: 8/30/2012
Authors: Nien F Zhang, Richard M Silver, Hui Zhou, Bryan M Barnes
Abstract: Recently, there has been significant research investigating new optical technologies for dimensional metrology of features 22 nm in critical dimension and smaller. When modeling optical measurements, a library of curves is assembled through the simul ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=907847

6. Phase sensitive parametric optical metrology: Exploring the limits of 3-dimensional optical metrology
Published: 4/4/2012
Authors: Richard M Silver, Jing Qin, Bryan M Barnes, Hui Zhou, Ronald G Dixson, Francois Romain Francis Goasmat
Abstract: There has been much recent work in developing advanced optical metrology applications that use imaging optics for critical dimension measurements, defect detection and for potential use with in-die metrology applications. Sensitivity to nanometer sca ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=911039

7. Scatterfield Microscopy of 22 nm Node Patterned Defects using Visible and DUV Light
Published: 4/4/2012
Authors: Bryan M Barnes, Martin Yeungjoon Sohn, Francois Romain Francis Goasmat, Hui Zhou, Richard M Silver, Abraham Arceo
Abstract: Smaller patterning dimensions and novel architectures are fostering research into improved methods of defect detection in semiconductor device manufacturing. This initial experimental study, augmented with simulation, evaluates scatterfield microscop ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=910963

8. Fundamental Limits of Optical Patterned Defect Metrology
Published: 11/14/2011
Authors: Richard M Silver, Bryan M Barnes, Martin Yeungjoon Sohn, Hui Zhou, Jing Qin
Abstract: The semiconductor manufacturing industry is now facing serious challenges in achieving defect detection rates with acceptable throughput and accuracy. With conventional bright-field and dark-field inspection methods now at their limits, it has becom ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=908849

9. A Bayesian Statistical Model for Hybrid Metrology to Improve Measurement Accuracy
Published: 7/31/2011
Authors: Richard M Silver, Nien F Zhang, Bryan M Barnes, Jing Qin, Hui Zhou, Ronald G Dixson
Abstract: We present a method to combine measurements from different techniques that reduces uncertainties and can improve measurement throughput. The approach directly integrates the measurement analysis of multiple techniques that can include different conf ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=908377

10. Optical illumination optimization for patterned defect inspection
Published: 4/20/2011
Authors: Bryan M Barnes, Richard Quintanilha, Martin Yeungjoon Sohn, Hui Zhou, Richard M Silver
Abstract: Rapidly decreasing critical dimensions (CD) for semiconductor devices drive the study of improved methods for the detection of defects within patterned areas. As reduced CDs are being achieved through directional patterning, additional constraints a ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=908276