You searched on: Author: mark vaudin
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81. The Influence of Additives on the Room-Temperature Recrystallization of Electrodeposited Copper
Gery R Stafford, Mark D Vaudin, Thomas P Moffat, N G Armstrong, David R Kelley
The recrystallization behavior of copper, electrodeposited from a copper sulfate-sulfuric acid plating bath into which various combinations of NaCl, sodium 3-mercapto-1propanesulfonate (MPSA), the polyethylene glycol (PEG) has been added, was examine ...
82. X-Ray Diffraction Study of the Optimization of MgO Growth Conditions for Magnetic Tunnel Junctions
O Se Young, C G Lee, Alexander J. Shapiro, William F. Egelhoff Jr., Mark D Vaudin, Jennifer L Klamo, J Mallett, Philip Pong
MgO based magnetic tunnel junctions (MTJs) show large tunneling magnetoresistance (TMR) effects and are currently the most promising technology for the applications in magnetoelectronics devices. Conventional MTJs with amorphous AlOx barriers yield T ...