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Author: benjamin tsai

Displaying records 31 to 40 of 96 records.
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31. Calibration of a Heat Flux Sensor Up to 200 kW/m^u2^ in a Spherical Blackbody Cavity
Published: 1/1/2002
Authors: A V Murthy, Benjamin K Tsai, Robert D. Saunders
Abstract: This paper presents the results of a comparative study of narrow view-angle and wide view-angle calibrations of a water-cooled Schmidt-Boelter heat-flux sensor. The narrow view-angle calibration, up to a heat flux level of 50 kW/m2, was conducted us ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=841595

32. Effects of Wafer Emissivity on Rapid Thermal Processing Temperature Measurement
Published: 1/1/2002
Authors: D H Chen, D P DeWitt, K G Kreider, Benjamin K Tsai, W A. Kimes
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=104361

33. Improving Temperature Accuracy for Rapid Thermal Processing at NIST
Published: 1/1/2002
Authors: Benjamin K Tsai, D P DeWitt
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=104789

34. Transfer Calibration Validation Tests on a Heat Flux Sensor in the 51 mm High-Temperature Blackbody
Series: Journal of Research (NIST JRES)
Published: 10/1/2001
Authors: A V Murthy, Benjamin K Tsai, Robert D. Saunders
Abstract: Facilities and techniques to characterize heat flux sensors are under development at the National Institute of Standards and Technology. As a part of this effort, a large aperture high-temperature blackbody was commissioned recently. The graphite tub ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=841556

35. Effects of Wafer Emissivity on Light-Pipe Rediometry in RTP Tools
Published: 9/1/2001
Authors: Kenneth Gruber Kreider, David W Allen, D H Chen, D P DeWitt, Christopher W Meyer, Benjamin K Tsai
Abstract: We investigated the effect of different wafer emissivities and the effect of low emissivity films on rapid thermal processing (RTP) wafer temperature measurements using lightpipe radiation thermometers (LPRTs). These tests were performed in the NIST ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=830751

36. Bidirectional Reflectance Distribution Function of Rough Silicon Wafers
Published: 7/1/2001
Authors: Y J Shen, Z M Zhang, Benjamin K Tsai, D P DeWitt
Abstract: The trend towards miniaturization of patterning features in integrated circuits (IC) has made traditional batch furnaces inadequate for many processes. Rapid thermal processing (RTP) for silicon wafers has become more popular in recent years for IC ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=841468

37. ITS-90 Calibration of Radiation Thermometers for RTP Using Wire/Thin-Film Thermocouples on a Wafer
Published: 6/1/2001
Authors: Christopher W Meyer, D P DeWitt, Kenneth Gruber Kreider, Francis John Lovas, Benjamin K Tsai
Abstract: Light-pipe radiation thermometers (LPRTs) are the sensor system of choice in RTP tools. They can be calibrated against blackbodies with an uncertainty (k=1) less than 0.3 C. In an RTP tool, however, account must be made for wafer emissivity and w ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=830687

38. Methods Used at NIST to Characterize and Callibrate Lightpipe Radiation Thermometers
Published: 6/1/2001
Authors: Benjamin K Tsai, D P DeWitt
Abstract: Lightpipe radiation thermometers (LPRTs) are the sensors of choice for high temperature thermal processing of sillicon wafers. At temperatures above 800 K, sapphire LPRTs are capable of indicating temperature differences and temperatures with an unc ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=841554

39. Transfer Calibration Validation Tests on a Heat Flux Sensor in the 51 mm High-Temperature-Blackbody
Published: 5/1/2001
Authors: A V Murthy, Benjamin K Tsai, Robert D. Saunders
Abstract: Facilities and techniques to characterize heat flux sensors are under development at the National Institute of Standards and Technology. As a part of this effort, a large aperture high-temperature blackbody was commissioned recently. The graphite tub ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=841532

40. Noncontact Thermometry in the Optical Technology Division at NIST
Published: 3/1/2001
Authors: Charles E Gibson, Howard W Yoon, Benjamin K Tsai, Bettye C Johnson, Robert D. Saunders
Abstract: The Optical Technology Division (OTD) at the National Institute of Standards and Technology (NIST) maintains the thermodynamic temperature scale above the silver freezing point using spectral radiance ratios according to the International Temperature ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=841548



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