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Author: hae-jeong lee

Displaying records 11 to 20 of 37 records.
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11. Characterizing Pattern Structures Using X-Ray Reflectivity
Published: 3/28/2008
Authors: Hae-Jeong Lee, Christopher Soles, Hyun W. Ro, Shuhui Kang, Eric K Lin, Alamgir Karim, Wen-Li Wu
Abstract: Specular X-ray reflectivity (SXR) can be used, in the limit of the effective medium approximation (EMA), as a high-resolution shape metrology for periodic patterns on a planar substrate. The EMA means that the density of the solid pattern and the sp ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=852735

12. Nanoimprint Lithography for the Direct Patterning of Nanoporous Interlayer Dielectric Insulator Materials
Published: 3/28/2008
Authors: Hyun W. Ro, Hae-Jeong Lee, Eric K Lin, Alamgir Karim, Daniel R. Hines, Do Y. Yoon, Christopher Soles
Abstract: Directly patterning dielectric insulator materials for semiconductor devices via nanoimprint lithography has the potential to simplify fabrication processes and reduce manufacturing costs. However, the prospect of mechanically forming these material ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=852733

13. Non Uniform Structural Degradation in Porous Organosilicate Films Exposed to Plasma, Etching and Ashing as Characterized by X-Ray Porosimetry
Published: 10/25/2007
Authors: Hae-Jeong Lee, Christopher Soles, Eric K Lin, Wen-Li Wu, Yiping Liu
Abstract: The microelectronics industry critically needs non-destructive methodologies capable of profiling the porosity characteristics as a function of depth in the highly porous film that are used as interlayer dielectric insulators in integrated semiconduc ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=852742

14. The Direct Patterning of Nanoporous Interlayer Dielectric Insulator Films by Nanoimprint Lithography
Published: 10/2/2007
Authors: Hyun W. Ro, Ronald Leland Jones, H Peng, Daniel R. Hines, Hae-Jeong Lee, Eric K Lin, Alamgir Karim, Do Y. Yoon, D Gidley, Christopher Soles
Abstract: Directly patterning dielectric insulator materials via nanoimprint lithography has the potential to simplify fabrication processes and significantly reduce the manufacturing costs for semiconductor devices. However, the prospect of mechanically form ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=852642

15. Structure Characterization of Nanoporous Interlevel Dielectric Thin Films With X-Ray and Neutron Radiation
Published: 3/6/2007
Authors: Christopher Soles, Hae-Jeong Lee, B D. Vogt, Eric K Lin, Wen-Li Wu
Abstract: The structure characterization of nanoporous interlevel dielectric (ILD) thin films is challenging because of the small sample volumes and nanometer dimensions of the pores. In this chapter, we review characterization methods for porous ILD material ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=852526

16. Mechanically Robust Spin-On Organosilicates Glasses for Nanoporous Applications
Published: 2/7/2007
Authors: Hyun W. Ro, K Char, Eun-Chae Jeon, H C Kim, Dongil Kwon, Hae-Jeong Lee, J. H. Lee, Hee-Woo Rhee, Christopher Soles, Do Y. Yoon
Abstract: An increasing number of technologies demand nanoporous materials with vastly improved physical, mechanical and thermal properties. This manuscript develops the microstructural basis for synthesizing organosilicate glasses (OSGs) with unprecedented ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=852621

17. Evidence for Internal Stresses Induced by Nanoimprint Lithography
Published: 11/30/2006
Authors: Hyun W. Ro, Yifu Ding, Hae-Jeong Lee, Daniel R. Hines, Ronald Leland Jones, Eric K Lin, Alamgir Karim, Wen-Li Wu, Christopher Soles
Abstract: The thermal embossing form of nanoimprint lithography is used to pattern arrays of nanostructures into several different polymer films. The shape of the imprinted patterns is characterized with nm precision using both X-ray scattering and reflectivi ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=852638

18. Structural Characteristics of Methylsilsesquioxane Based Porous Low-k Thin Films Fabricated with Increasing Cross-Linked Particle Porogen Loading
Published: 9/1/2006
Authors: Hae-Jeong Lee, Christopher Soles, Da-Wei Liu, Barry J. Bauer, Eric K Lin, Wen-Li Wu
Abstract: Methylsilsesquioxane (MSQ) based porous low-k dielectric films with different porogen loading have been characterized using X-ray porosimetry (XRP) to determine their pore size distribution, average density, wall density and porosity. By varying the ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=852378

19. Effect of Initial Resist Thickness on Residual Layer Thickness of Nanoimprinted Structures
Published: 12/1/2005
Authors: Hae-Jeong Lee, Hyun W. Ro, Christopher Soles, Ronald Leland Jones, Eric K Lin, Wen-Li Wu, Daniel R. Hines
Abstract: Accurate quantification and control of the residual layer thickness is a critical challenge to achieving sub-50 nm patterning with nanoimprint lithography. While characterization to within a few nanometers is essential, there is currently a lack of ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=852524

20. Specular X-Ray Reflectivity and Small Angle Neutron Scattering for Structure Determination of Ordered Mesoporous Films
Published: 9/1/2005
Authors: B D. Vogt, Hae-Jeong Lee, Wen-Li Wu, Yiping Liu
Abstract: The structure of mesoporous materials, in terms of morphology and orientation, is critical for numerous applications. X-ray reflectivity (XR) and small angle neutron scattering (SANS) are used for the non-destructive, structural characterization of ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=852507



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