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Author: robert keller
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1. An Electrical Method for Measuring Fatigue and Tensile Properties of Thin Films on Substrates
Published: 8/15/2007
Authors: Robert R Keller, Nicholas Barbosa, Roy Howard Geiss, David Thomas Read
Abstract: A novel approach for measuring thermal fatigue lifetime and ultimate strength of patterned thin films on substrates is presented. The method is based on controlled application of cyclic joule heating by means of low-frequency, high-density alternatin ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=50479

2. COMPARISON OF TEXTURE IN COPPER AND ALUMINUM THIN FILMS AS DETERMINED BY XRD AND EBSD
Published: 10/2/2006
Authors: Jens Mueller, Davor Balzar, Roy Howard Geiss, David Thomas Read, Robert R Keller
Abstract: Texture in materials has a large influence on many properties of thin films; it is customarily determined by neutron or X-ray diffraction by measuring pole figures and evaluating orientation-distribution functions (ODF). X-ray diffraction (XRD) was t ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=50205

3. Electric Current Induced Thermomechanical Fatigue Testing of Interconnects
Published: 3/1/2005
Authors: Robert R Keller, Roy Howard Geiss, Yi-Wen Cheng, David Thomas Read
Abstract: We demonstrate the use of electrical methods for evaluating the thermomechanical fatigue properties of patterned aluminum and copper interconnects on silicon-based substrates. Through a careful selection of alternating current frequency and current d ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=50110

4. Electrical Methods for Mechanical Characterization of Interconnect Thin Films
Published: 9/1/2005
Authors: Robert R Keller, Cynthia A. Volkert, Roy Howard Geiss, Andrew J Slifka, David Thomas Read, Nicholas Barbosa, Reiner Monig
Abstract: We describe the use of electrical methods for evaluating mechanical reliability and properties of patterned copper and aluminum interconnects on silicon substrates. The approach makes use of controlled Joule heating, which causes thermal strains in t ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=50210

5. Electrical Reliability Testing of Single-Walled Carbon Nanotube Networks
Published: 5/18/2011
Authors: Mark C Strus, Ann Chiaramonti Chiaramonti Debay, Robert R Keller, Yung Joon Jung, Younglae Kim
Abstract: We present test methods to investigate the electrical reliability of nanoscale lines of highly-aligned, networked, metallic/semiconducting single-walled carbon nanotubes (SWCNTs) fabricated through a template-based fluidic assembly process. We find ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=907014

6. Electromigration of Cu Interconnects Under AC and DC Test Conditions
Published: 5/15/2011
Authors: Robert R Keller, David Thomas Read, Roey Shaviv, Greg Harm, Sangita Kumari
Abstract: Electromigration of a 65 nm technology generation test vehicle was measured using DC, AC followed by DC, and three rectangular wave DC stressing conditions at 598 K. In some of the experiments samples were allowed to cool to room temperature between ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=906901

7. Epitaxial (111) Films of Cu, Ni, and Cu^dx^Ni^dy^ on {alpha}{long dash}Al^d2^O^d3^(0001) for graphene growth by chemical vapor deposition
Published: 9/21/2012
Authors: David Lee Miller, Mark W Keller, Justin M Shaw, Ann Chiaramonti Chiaramonti Debay, Robert R Keller
Abstract: Films of (111)-textured Cu, Ni, and Cu^dx^Ni^dy^ were evaluated as substrates for chemical vapor deposition of graphene. A metal thickness of 400 nm to 700 nm was sputtered onto a substrate of {alpha}{long dash}Al^d2^O^d3^(0001) at temperatures of {I ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=911229

8. Evaluation of Thin Film Mechanical Properties by Means of Electrical Test Methods
Published: 9/30/2007
Authors: Nicholas Barbosa, Robert R Keller, David Thomas Read, Richard P. Vinci
Abstract: The ability to measure the mechanical properties of thin films and small scale structures is essential in designing reliable components at the micro- and nano-scales. It is known that the mechanical properties of thin film materials deviate from rela ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=50339

9. Metrologies for Mechanical Response of Micro- and Nanoscale Systems
Published: 1/1/2008
Authors: Robert R Keller, Donna C. Hurley, David Thomas Read, Paul Rice
Abstract: This chapter describes metrologies developed by NIST scientists and collaborators for mechanical properties of dimensionally-constrained materials; these approaches make use of methods inherently sensitive to small volumes. Attention is focused on d ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=50654

10. Microstructure Evolution during Alternating-Current-lnduced Fatigue
Published: 11/1/2004
Authors: Robert R Keller, Roy Howard Geiss, Yi-Wen Cheng, David Thomas Read
Abstract: Subjecting electronic interconnect lines to high-density, low.frequency alternating current creates cyclic thermomechanical stresses that eventually cause electrical failure. A detailed understanding of the failure process could contribute to both pr ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=50088



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