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You searched on: Author: robert keller Sorted by: title

Displaying records 1 to 10 of 30 records.
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1. An Analytical Scattering Model for Low Energy Annular Dark Field Transmission Scanning Electron Microscopy
Published: 9/22/2015
Authors: Taylor J Woehl, Jason D Holm, Robert R Keller
Abstract: Here we employ an analytical electron scattering model to show that the decrease in ADF t-SEM contrast of gold nanoparticles on carbon films is consistent with a competition between mass-thickness and atomic number contrast. Images of gold nanoparti ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=917964

2. An Electrical Method for Measuring Fatigue and Tensile Properties of Thin Films on Substrates
Published: 8/15/2007
Authors: Robert R Keller, Nicholas Barbosa, Roy H. Geiss, David Thomas Read
Abstract: A novel approach for measuring thermal fatigue lifetime and ultimate strength of patterned thin films on substrates is presented. The method is based on controlled application of cyclic joule heating by means of low-frequency, high-density alternatin ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=50479

3. Beam broadening in transmission EBSD
Published: 3/16/2015
Authors: Robert R Keller, Katherine P. Rice, Mark Stoykovich
Abstract: Transmission electron backscatter diffraction (t-EBSD), also known as transmission electron forward scatter diffraction (t-EFSD) or transmission Kikuchi diffraction in the SEM (TKD-SEM), can provide significant improvements in spatial resolution ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=917237

4. COMPARISON OF TEXTURE IN COPPER AND ALUMINUM THIN FILMS AS DETERMINED BY XRD AND EBSD
Published: 10/2/2006
Authors: Jens Mueller, Davor Balzar, Roy H. Geiss, David Thomas Read, Robert R Keller
Abstract: Texture in materials has a large influence on many properties of thin films; it is customarily determined by neutron or X-ray diffraction by measuring pole figures and evaluating orientation-distribution functions (ODF). X-ray diffraction (XRD) was t ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=50205

5. Detection of Atomic Force Microscopy Cantilever Displacement with a Transmitted Electron Beam
Published: 7/29/2016
Authors: Ryan B Wagner, Taylor J Woehl, Robert R Keller, Jason Philip Killgore
Abstract: Cantilever motion in atomic force microscopy (AFM) systems is typically measured with an optical lever system. The response time of AFM cantilevers can be decreased by reducing the size of the cantilever; however, the fastest AFM cantilevers are ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=920462

6. Electric Current Induced Thermomechanical Fatigue Testing of Interconnects
Published: 3/1/2005
Authors: Robert R Keller, Roy H. Geiss, Yi-Wen Cheng, David Thomas Read
Abstract: We demonstrate the use of electrical methods for evaluating the thermomechanical fatigue properties of patterned aluminum and copper interconnects on silicon-based substrates. Through a careful selection of alternating current frequency and current d ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=50110

7. Electrical Methods for Mechanical Characterization of Interconnect Thin Films
Published: 9/1/2005
Authors: Robert R Keller, Cynthia A. Volkert, Roy H. Geiss, Andrew J Slifka, David Thomas Read, Nicholas Barbosa, Reiner Monig
Abstract: We describe the use of electrical methods for evaluating mechanical reliability and properties of patterned copper and aluminum interconnects on silicon substrates. The approach makes use of controlled Joule heating, which causes thermal strains in t ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=50210

8. Electrical Reliability Testing of Single-Walled Carbon Nanotube Networks
Published: 5/18/2011
Authors: Mark C Strus, Ann Chiaramonti Chiaramonti Debay, Robert R Keller, Yung Joon Jung, Younglae Kim
Abstract: We present test methods to investigate the electrical reliability of nanoscale lines of highly-aligned, networked, metallic/semiconducting single-walled carbon nanotubes (SWCNTs) fabricated through a template-based fluidic assembly process. We find ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=907014

9. Electromigration of Cu Interconnects Under AC and DC Test Conditions
Published: 5/15/2011
Authors: Robert R Keller, David Thomas Read, Roey Shaviv, Greg Harm, Sangita Kumari
Abstract: Electromigration of a 65 nm technology generation test vehicle was measured using DC, AC followed by DC, and three rectangular wave DC stressing conditions at 598 K. In some of the experiments samples were allowed to cool to room temperature between ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=906901

10. Electromigration of Cu Interconnects Under AC, Pulsed-DC and DC Test Conditions - Ramifications on Accelerated Testing
Published: 4/10/2011
Authors: Robert R Keller, David Thomas Read, Roey Shaviv, Greg Harm, Sangita Kumari
Abstract: Electromigration (EM) of a dual damascene, single-via fed, test vehicle was measured using DC, AC followed by DC, and three rectangular-wave DC stressing conditions at 598 K. In some of the experiments samples were allowed to cool between stress cyc ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=907877



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