NIST logo

Publications Portal

You searched on:
Author: allen hefner jr
Sorted by: date

Displaying records 1 to 10 of 144 records.
Resort by: Date / Title


1. NIST Framework and Roadmap for Smart Grid Interoperability Standards, Release 3.0
Series: Special Publication (NIST SP)
Report Number: 1108r3
Published: 10/1/2014
Authors: Christopher Greer, David A Wollman, Dean Eldon Prochaska, Paul A Boynton, Jeffrey A. Mazer, Cuong T Nguyen, Gerald J FitzPatrick, Thomas L Nelson, Galen H Koepke, Allen R Hefner Jr, Victoria Y Pillitteri, Tanya L Brewer, Nada T Golmie, David H Su, Allan C Eustis, David G Holmberg, Steven T Bushby
Abstract: Section 1305 of the Energy Independence and Security Act (EISA) of 2007 (Pub. L. 110‹140) directs NIST ,,to coordinate the development of a framework that includes protocols and model standards for information management to achieve interoperabili ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=916755

2. Physics-based Electro-thermal Saber Model and Parameter Extraction for High-Voltage SiC Buffer IGBTs
Published: 9/15/2014
Authors: Tam Hoang Duong, Allen R Hefner Jr, Jose Miguel Ortiz, Sei-Hyung Ryu , Edward VanBrunt, Lin Cheng, Scott Allen, John W. Palmour
Abstract: The purpose of this paper is to present a physics-based electro-thermal Saber model and parameter extraction sequence for high-voltage SiC buffer layer n-channel insulated gate bipolar transistors (IGBTs). This model was developed by modifying and ex ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=916319

3. Thermo-Mechanical Characterization of Au‹In Transient Liquid Phase Bonding Die-Attach
Published: 4/9/2013
Authors: Brian Joseph Grummel, Habib A Mustain, Z. John Shen, Allen R Hefner Jr
Abstract: In next-generation wide-bandgap power electronics, the semiconductor device die-attach is of critical importance, for this transient liquid phase (TLP) bonding is a promising and effective die-attach technique. In this work, the thermal and mechanica ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=911241

4. Electro-Thermal Simulation and Design of a 60 A, 4.5 kV Half-Bridge Si IGBT/SiC JBS Hybrid Power Module
Published: 9/15/2012
Authors: Tam Hoang Duong, Allen R Hefner Jr, Karl Hobart
Abstract: This paper presents the results from a parametric simulation study that was conducted to optimize the design of a high-current 4.5 kV half-bridge Si-IGBT/SiC-JBS hybrid module for medium voltage hard-switched power conversion as well as to compare th ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=911712

5. NIST Framework and Roadmap for Smart Grid Interoperability Standards, Release 2.0
Series: Special Publication (NIST SP)
Report Number: 1108R2
Published: 2/16/2012
Authors: George W Arnold, Gerald J FitzPatrick, David A Wollman, Thomas L Nelson, Paul A Boynton, Galen H Koepke, Allen R Hefner Jr, Cuong T Nguyen, Jeffrey A. Mazer, Dean Eldon Prochaska, Marianne M. Swanson, Tanya L Brewer, Victoria Y Pillitteri, David H Su, Nada T Golmie, Eric D Simmon, Allan C Eustis, David G Holmberg, Steven T Bushby, Michael D Janezic, Ajitkumar Jillavenkatesa
Abstract: The Energy Independence and Security Act (EISA) of 2007 requires that NIST develop a framework of standards for the Smart Grid. This document is the second release of the framework first published in January, 2010. It covers the activities and output ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=910824

6. Coordination and Acceleration of Smart Grid Interoperability Standards
Published: 12/2/2011
Author: Allen R Hefner Jr
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=908472

7. Performance of Hybrid 4.5kV SiC JBS Freewheeling Diode and Si IGBT
Published: 9/16/2011
Authors: Karl Hobart, Eugene Imhoff, F. J. Kub, Allen R Hefner Jr, Tam Hoang Duong, Jose Miguel Ortiz, Sei-Hyung Ryu, David Grider, Scott G Leslie, Jerry Sherbondy, B Ray
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=909897

8. Comparison of Au-In Transient Liquid Phase Bonding Designs for SiC Power Semiconductor Device Packaging
Published: 7/18/2011
Authors: Brian Joseph Grummel, Z. John Shen, Allen R Hefner Jr
Abstract: Transient liquid phase (TLP) bonding is an advanced die-attach technique for wide-bandgap power semiconductor and high-temperature packaging. TLP bonding advances current soldering techniques by raising the melting point to over 500 °C without detrim ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=909898

9. Reliability Study of Au-In Transient Liquid Phase Bonding for SiC Power Semiconductor Devices
Published: 5/24/2011
Authors: Brian Joseph Grummel, Habib A Mustain, Z. John Shen, Allen R Hefner Jr
Abstract: Transient Liquid Phase (TLP) bonding is a promising technique for SiC and other wide-bandgap power semiconductor device die-attach and high temperature packaging. TLP bonding advances modern solder technology by raising the solder melting point to ov ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=908130

10. Development, Performance and Applications of 4.5 kV SiC JBS Diodes
Published: 3/22/2011
Author: Allen R Hefner Jr
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=908466



Search NIST-wide:


(Search abstract and keywords)


Last Name:
First Name:







Special Publications:

Looking for a NIST Special Publication (NIST SP Series)? Place the series number and dash in the report number field (Example: 800-) and begin your search.

  • SP 250-XX: Calibration Services
  • SP 260-XX: Standard Reference Materials
  • SP 300-XX: Precision Measurement and Calibration
  • SP 400-XX: Semiconductor Measurement Technology
  • SP 480-XX: Law Enforcement Technology
  • SP 500-XX: Computer Systems Technology
  • SP 700-XX: Industrial Measurement Series
  • SP 800-XX: Computer Security Series
  • SP 823-XX: Integrated Services Digital Network Series