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You searched on: Author: christina hacker

Displaying records 31 to 40 of 57 records.
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31. Flip Chip Lamination Approach to Fabricate Top Metal Contacts on Organic-based Devices
Published: 3/15/2010
Authors: Mariona Coll Bau, Oana Jurchescu, Nadine Emily Gergel-Hackett, Curt A Richter, Christina Ann Hacker
Abstract: Flip Chip Lamination approach to fabricate top metal contacts on organic-based devices ; M.Coll, O.D. Jurchescu, N. Gergel-Hackett, C.A. Richter, C,A, Hacker, American Physical Society (APS), March 2010, Portland, OR, USA (oral)
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=907069

32. Nanoelectronic Fabrication with Flip Chip Lamination
Published: 12/15/2009
Authors: Mariona Coll Bau, Curt A Richter, Christina Ann Hacker
Abstract: Nanoelectronic fabrication with Flip chip lamination Mariona Coll, CA Richter, CA Hacker, Colloquium Catalan Institute of Nanoscience and Nanotechnology CIN2, Barcelona Spain, Dec 2009.
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=907070

33. Modifying electron transfer at the silicon-molecule interface using atomic tethers
Published: 12/10/2009
Author: Christina Ann Hacker
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=907065

34. Thermal Stability of Confined Flip-Chip Laminated w-Functionalized Monolayers
Published: 12/3/2009
Authors: Mariona Coll Bau, Curt A Richter, Christina Ann Hacker
Abstract: We present the results of an IR study of the effect of temperature on the formation of Au-monolayer-Si molecular junctions by using a flip-chip lamination approach. Carboxylic acid-terminated alkanethiols self-assembled on ultrasmooth gold substrate ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=903011

35. Fabrication with Flip-Chip Lamination
Published: 11/15/2009
Authors: Mariona Coll Bau, Curt A Richter, Christina Ann Hacker
Abstract: Fabrication with Flip-Chip Lamination , Mariona Coll, DR Hines, CA Richter, CA Hacker, Nanotechnology colloquium, Wake Forest University, 11-09.
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=907071

36. Fabrication with Flip-Chip Lamination
Published: 10/15/2009
Authors: Mariona Coll Bau, Curt A Richter, Christina Ann Hacker
Abstract: Fabrication with Flip-Chip Lamination , Mariona Coll, DR Hines, CA Richter, CA Hacker, MRSEC surface physics colloquium, University of Maryland, College Park, 10-09.
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=907072

37. Formation of Silicon-Based Molecular Electronic Structures Using Flip-chip Lamination
Published: 8/11/2009
Authors: Mariona Coll Bau, Lauren H. Miller, Lee J Richter, Daniel R. Hines, Curt A Richter, Christina Ann Hacker
Abstract: The use of organic molecules to impart electrical surface properties has been a subject of intense research not only from a fundamental perspective but for many technological applications. In particular, organic molecules have been proposed as activ ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=901565

38. Flexible Solution-Processed Memristors
Published: 6/3/2009
Authors: Nadine Emily Gergel-Hackett, Behrang H Hamadani, B Dunlap, John S Suehle, Curt A Richter, Christina Ann Hacker, David J Gundlach
Abstract: We have fabricated physically flexible nonvolatile memory devices using inexpensive, room-temperature, solution processing. The behavior of these devices is consistent with that of a memristor device, the missing fourth circuit element theoreticall ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=900874

39. Ultrasmooth Gold as a Top Metal Electrode for Molecular Electronic Devices
Published: 4/7/2009
Authors: Mariona Coll Bau, Christina Ann Hacker, Lauren H. Miller, Daniel R. Hines, E. C. Williams, Curt A Richter
Abstract: In the emerging area of molecular electronics, fabrication of reliable metallic contacts remains one of the most critical challenges. Nanotransfer printing (nTP) is an attractive low-cost non-destructive technique to provide contact to organic monola ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=900902

40. The Integration of Molecular Electronic Devices with Traditional CMOS Technologies
Published: 8/28/2008
Authors: Nadine Emily Gergel-Hackett, Askia A Hill, Christina Ann Hacker, Curt A Richter
Abstract: This work describes the development of hybrid circuits composed of silicon-based molecular electronic devices and traditional CMOS technology. In the development of these circuits, we first fabricated individual CMOS-compatible molecular electronic ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=33021



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