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1. An Electrical Method for Measuring Fatigue and Tensile Properties of Thin Films on Substrates
Published: 8/15/2007
Authors: Robert R Keller, Nicholas Barbosa, Roy H. Geiss, David Thomas Read
Abstract: A novel approach for measuring thermal fatigue lifetime and ultimate strength of patterned thin films on substrates is presented. The method is based on controlled application of cyclic joule heating by means of low-frequency, high-density alternatin ...

2. Coming Full Circle: The Application of Microtechnology Techniques to Evaluate Bulk Materials
Published: 11/29/2010
Authors: David Thomas Read, Nicholas Barbosa
Abstract: A tensile test procedure that accommodates specimens with gauge section 25 μm by 70 μm by 300 μm was developed and demonstrated. The instrumentation and technique were adapted from those previously developed and used to test thin films ...

3. Constraint Effect in Deformation of Copper Interconnect Lines Subjected to Cyclic Joule Heating
Published: 11/26/2007
Authors: David Thomas Read, Roy H. Geiss, Nicholas Barbosa
Abstract: Using finite element analysis, we calculate the temperature range and the resulting cyclic Von Mises strain resulting from Joule heating, generated by the application of alternating current, applied to specimens representative of commercial copper da ...

4. Electrical Methods for Mechanical Characterization of Interconnect Thin Films
Published: 9/1/2005
Authors: Robert R Keller, Cynthia A. Volkert, Roy H. Geiss, Andrew J Slifka, David Thomas Read, Nicholas Barbosa, Reiner Monig
Abstract: We describe the use of electrical methods for evaluating mechanical reliability and properties of patterned copper and aluminum interconnects on silicon substrates. The approach makes use of controlled Joule heating, which causes thermal strains in t ...

5. Evaluation of Thin Film Mechanical Properties by Means of Electrical Test Methods
Published: 9/30/2007
Authors: Nicholas Barbosa, Robert R Keller, David Thomas Read, Richard P. Vinci
Abstract: The ability to measure the mechanical properties of thin films and small scale structures is essential in designing reliable components at the micro- and nano-scales. It is known that the mechanical properties of thin film materials deviate from rela ...

6. Fatigue crack growth rates of API X70 pipeline steel in a pressurized hydrogen gas environment
Published: 12/21/2013
Authors: Elizabeth S Drexler, Andrew J Slifka, Robert L Amaro, Nicholas Barbosa, Damian S Lauria, Louis E. Hayden, Douglas G Stalheim
Abstract: Hydrogen is known to have a deleterious effect on metal, but pipelines will still be the most cost- effective means of transporting hydrogen gas and sour gas. Rather, it is the codes and standards, such as ASME B31.12, that will guide the design o ...

7. Interaction of environmental conditions: Role in the reliability of active implantable devices
Published: 6/7/2007
Authors: Elizabeth S Drexler, Andrew J Slifka, Nicholas Barbosa, John W. Drexler
Abstract: Present techniques for assessing the reliability of active implantable medical devices (AIMDs) rely on testing one or two environmental conditions at a time. But the interaction of these environmental conditions may have a greater impact on reliabili ...

8. MEMS-based Universal Fatigue-Test Technique
Published: 6/13/2013
Authors: David Thomas Read, Li-Anne Liew, Nicholas Barbosa
Abstract: We report the development and demonstration of a MEMS test instrument to perform fatigue testing on 25 µm thick aluminum 1145 H19 foil. Both the foil material and the specimen fabrication were obtained from commercial sources, separate from the fabri ...

9. Mapping substrate/film adhesion with contact-resonance-frequency AFM
Published: 7/12/2006
Authors: Donna C. Hurley, Malgorzata Kopycinska-Mueller, Eric Langlois, Tony B. Kos, Nicholas Barbosa
Abstract: We demonstrate contact-resonance-frequency atomic force microscopy (AFM) techniques to nondestructively image variations in adhesion at a substrate/film interface. Contact-resonance-frequency imaging is a dynamic AFM technique to measure the contact ...

10. Results of a Nanoindentation Round Robin on Thin Film Copper on Silicon
Published: 1/1/2007
Authors: David Thomas Read, Robert R Keller, Nicholas Barbosa, Roy H. Geiss
Abstract: Nanoindentation is used in a variety of fields to measure material hardness and elastic modulus. This test technique is especially attractive for thin films because of the difficulty of conducting tensile or other conventional mechanical characteriza ...

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