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Author: nicholas barbosa
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1. Spatially and Temporally Resolved Thermal Imaging of Cyclically Heated Interconnects by Use of Scanning Thermal Microscopy
Published: 1/1/2008
Authors: Nicholas Barbosa, Andrew J Slifka
Abstract: A scanning thermal microscope (SThM) was used to investigate the spatial and temporal distribution of temperature in electrical interconnect structures designed for measuring the mechanical properties of thin films. Knowledge of the thermal behavior ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=50398

2. Constraint Effect in Deformation of Copper Interconnect Lines Subjected to Cyclic Joule Heating
Published: 11/26/2007
Authors: David Thomas Read, Roy Howard Geiss, Nicholas Barbosa
Abstract: Using finite element analysis, we calculate the temperature range and the resulting cyclic Von Mises strain resulting from Joule heating, generated by the application of alternating current, applied to specimens representative of commercial copper da ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=901599

3. Evaluation of Thin Film Mechanical Properties by Means of Electrical Test Methods
Published: 9/30/2007
Authors: Nicholas Barbosa, Robert R Keller, David Thomas Read, Richard P. Vinci
Abstract: The ability to measure the mechanical properties of thin films and small scale structures is essential in designing reliable components at the micro- and nano-scales. It is known that the mechanical properties of thin film materials deviate from rela ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=50339

4. An Electrical Method for Measuring Fatigue and Tensile Properties of Thin Films on Substrates
Published: 8/15/2007
Authors: Robert R Keller, Nicholas Barbosa, Roy Howard Geiss, David Thomas Read
Abstract: A novel approach for measuring thermal fatigue lifetime and ultimate strength of patterned thin films on substrates is presented. The method is based on controlled application of cyclic joule heating by means of low-frequency, high-density alternatin ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=50479

5. Interaction of environmental conditions: Role in the reliability of active implantable devices
Published: 6/7/2007
Authors: Elizabeth S Drexler, Andrew J Slifka, Nicholas Barbosa, John W. Drexler
Abstract: Present techniques for assessing the reliability of active implantable medical devices (AIMDs) rely on testing one or two environmental conditions at a time. But the interaction of these environmental conditions may have a greater impact on reliabili ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=50532

6. Results of a Nanoindentation Round Robin on Thin Film Copper on Silicon
Published: 1/1/2007
Authors: David Thomas Read, Robert R Keller, Nicholas Barbosa, Roy Howard Geiss
Abstract: Nanoindentation is used in a variety of fields to measure material hardness and elastic modulus. This test technique is especially attractive for thin films because of the difficulty of conducting tensile or other conventional mechanical characteriza ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=50334

7. Strain-Induced Grain Growth during Rapid Thermal Cycling of Aluminum Interconnects
Published: 1/1/2007
Authors: Robert R Keller, Roy Howard Geiss, Nicholas Barbosa, Andrew J Slifka, David Thomas Read
Abstract: We demonstrate by use of automated electron backscatter diffraction (EBSD) the rapid growth of grains in non-passivated, sputtered Al-1Si interconnects during 200 Hz thermal cycling induced by alternating electric current. Mean grain diameters were o ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=50338

8. Mapping substrate/film adhesion with contact-resonance-frequency AFM
Published: 7/12/2006
Authors: Donna C. Hurley, Malgorzata Kopycinska-Mueller, Eric Langlois, Tony B. Kos, Nicholas Barbosa
Abstract: We demonstrate contact-resonance-frequency atomic force microscopy (AFM) techniques to nondestructively image variations in adhesion at a substrate/film interface. Contact-resonance-frequency imaging is a dynamic AFM technique to measure the contact ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=50316

9. Electrical Methods for Mechanical Characterization of Interconnect Thin Films
Published: 9/1/2005
Authors: Robert R Keller, Cynthia A. Volkert, Roy Howard Geiss, Andrew J Slifka, David Thomas Read, Nicholas Barbosa, Reiner Monig
Abstract: We describe the use of electrical methods for evaluating mechanical reliability and properties of patterned copper and aluminum interconnects on silicon substrates. The approach makes use of controlled Joule heating, which causes thermal strains in t ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=50210



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