George G. Harman is a retired Fellow of the National Institute of Standards and Technology (NIST). He has a BS in industrial physics from Virginia Polytechnic Institute & State University and an MS in physics from the University of Maryland (1959). Harman is a former President of IMAPS (1995-1996) and Chair of the IEEE CPMT Fellow Committee (1988-2002). He is a life fellow of both IMAPS and of the IEEE. He has held many other elected and appointed positions in those societies and is a member of the ITRS Roadmap Committee for Assembly and Packaging (for more than 10 years).
Harman is widely considered to be the world's foremost authority on wire bonding. He has published more than 60 papers, 3 books on wire bonding, 8 book chapters, and 4 patents. He also has given about 100, 8-hour, short courses on wire bonding around the world (over the past 30 years). He has received numerous awards, both domestically and internationally. His most recent were the IMAPS "Lifetime Achievement Award" (2006) and the IEEE "Field Award for Components, Packaging, and Manufacturing Technology" (2009).
Semiconductor & Dimensional Metrology Division