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Call for Papers

Papers are solicited to address materials and device characterization and metrology for:

  • 450 mm

  • 3D IC Analysis / Metrology

  • III-V on Si for Advanced CMOS

  • Alternative Gate Dielectrics

  • Breakthroughs in Electron Microscopy

  • Breakthroughs in Lithography

  • Channel Engineering (e.g., strained silicon, 3/5s)

  • Characterization of Nanoscale Sensors and Devices for Health, Environment Monitoring

  • CMOS, Extreme CMOS, Beyond CMOS

  • Contamination, Detection, and Identification

  • Critical Analytical Techniques; Defectivity for epi in FAB

  • Defects

  • Device Manufacturing

  • Diagnostics

  • Embedded or Buried Interfaces

  • Flexible (Si-based) Microelectronics

  • Graphene and 2D Materials and Devices (including topological insulators)

  • Heterogeneous Integration

  • HybridStructures (inorganic islands in flexible organic substrates)

  • In-Situ, Real-Time Control and Monitoring

  • Integrated Metrology

  • Interconnects (Present or Future)

  • Internet of Things

  • Lab-on-a-Chip

  • Magnetics

  • MEMS/NEMS Metrology Applications

  • Modeling/Simulation

  • Modeling and Simulation of Spectroscopic Properties for Novel Materials for Nanoelectronics

  • More than Moore

  • Nanoelectronics Materials and Devices

  • Nanoscale Electrical Measurements

  • Nanoscale Optical Measurements

  • Non-Destructive Atomic Scale Methods

  • Novel Measurement Methods, Breakthroughs

  • Organic Electronics

  • Physical and Electrical Reliability Studies of Nanoscale Manufacturing, Exploratory Devices, Advanced Packaging, etc.

  • Power Microelectronics (GaN and related compounds)

  • RAM, Resistive RAM, STT-RAM

  • Si Photonics

  • Spectroscopic Properties for NovelMaterials for Nanoelectronics

  • Spintronics

  • Synchrotron and Neutron Techniques

  • Thin-Films

  • Ultra-Shallow Junctions

  • Wafer Fab

  • Wafer Manufacturing and New Substrate Materials

Extended Abstracts

Camera-ready abstracts of 2-3 pages must be received by Mar. 25, 2015. The template is available on-line. A cover page must include the name, address, telephone number, and e-mail address of the contact author. Please be sure also to include a list of 3-6 key words in the appropriate section at the end of the abstract. Your abstract should include at least one figure and/or table presenting data.   

Accepted abstracts will appear in the conference’s extended abstract book, which will be available on-line and distributed at the event.

Address all abstracts to the conference publications coordinator, Erik Secula. Please send Microsoft Word or Adobe PDF files. If e-mail is not a practical option, please contact Erik Secula at (301) 975-2050 to make alternative arrangements.