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2011 Conference Program

The conference consists of formal invited presentations sessions and poster sessions for contributed papers.

Please note: Adobe Acrobat Reader will be needed to view the abstracts for these presentations. If you do not have this program, you may download it free of charge. The software is identified in order to assist users of this information service. In no case does such identification imply recommendation or endorsement by the National Institute of Standards and Technology.

 

Events

MINATEC Facility Tour

A tour of the MINATEC facility will be held on Monday, May 23rd, from 3:00 PM to 5:00 PM. Advanced sign-up is required.

Sign-up for this event is now closed.

Reception

A welcome reception will be held at the MINATEC Campus on Monday, May 23rd from 5:00 PM to 8:00 PM. Heavy hors d'oeuvres will be served. A registration desk will be open to receive your conference badge and final program booklet.

Banquet

A dinner banquet will be held on Wednesday, May 25th, at "restaurant du téléphérique" at the Bastille. A tramway in front of MINATEC will depart at 6:45 PM, followed by a 10 minute walk through the "Jardin de Ville" and then cable car to the restaurant.

Poster Sessions

Dedicated poster sessions with refreshments will be held each day of the conference: 5:00 PM on Tuesday, 3:30 PM on Wednesday, and 5:30 PM on Thursday. Posters will also be available to view during lunch and coffee breaks.

Excursion to Chamonix and Mont-Blanc

The conference organizers have arranged a full-day tour to Chamonix and Mont-Blanc for Friday, May 27th. Mont-Blanc (alt. 4807 meters, 15,771 feet), is the highest mountain in Western Europe and the third most visited natural site in the world. The cost of the tour is 170 €. This price includes all transportation as well as lunch. Addtitional details are available here.

 

Invited Presentations

Tuesday, May 24

Registration

7:30 AM – 8:45 AM

Conference Opening

8:45 AM

Conference Opening

David Seiler, NIST, Conference Chair

Keynote Talks

Session Chair: David Seiler, NIST

9:00 AM

Nanocharacterization Challenges in a Changing Microelectronics Landscape
Michel Brillouet, CEA-LETI

9:45 AM

Nanoelectronics and More-than-Moore at IMEC
Rudi Cartuyvels, IMEC

10:30 AM

Coffee Break and Poster Viewing

Technology Overview for Nanoelectronics and Metrology

Session Chair: Michel Brillouet, CEA-LETI

11:00 AM

More than Moore or More Moore: a SWOT Analysis
Dan Hutcheson, VLSI Research

11:30 PM

ITRS Review in Relation to Future Metrology Needs
Alain Diebold, College of Nanoscale Science and Engineering, SUNY Albany

Metrology for Beyond CMOS

Session Chair: George Thompson, Intel

12:00 PM

Metrology and Characterization Challenges for Emerging Research Materials and Devices
Mike Garner, formerly of Intel, Dan Herr, SRC, and Yaw Obeng, NIST

12:30 PM

Lunch and Poster Viewing

2:00 PM

Carbon Based Nanoelectronics
C.Y. Sung, IBM

2:30 PM

Quantum Control and Engineering of Single Spins
David Awschalom, UCSB

Theory, Modeling, and Simulation

Session Chair: Robert McDonald, formerly of Intel

3:00 PM

Discrete Tomography in Materials Science
K. Joost Batenburg, Centrum Wiskunde & Informatica

3:30 PM

Coffee Break and Poster Viewing

4:00 PM

Materials Modeling and Metrology
Sadas Shankar, Intel

Microscopy for Nanoelectronics (part one)

Session Chair: Amal Chabli, CEA-LETI

4:30 PM

TSOM Method for Nanoelectronics Dimensional Metrology
Ravikiran Attota, NIST

5:00 PM – 6:00 PM

Poster Session (with Wine and Cheese)

Wednesday, May 25

Registration

8:00 AM – 8:30 AM

Microscopy for Nanoelectronics (part two)

Session Chair: Amal Chabli, CEA-LETI

8:30 AM

State-of-the-art TEM for the Semiconductor Industry
David Cooper, CEA-LETI

9:00 AM

SPM-Microscopy for Nanoelectronics
P. De Wolf, Veeco

9:30 AM

Atom Probe Tomography of Semiconducting Materials
Ahmed Shariq, Fraunhofer CNT, Dresden, Germany

10:00 AM

Coffee Break and Poster Viewing

10:30 AM

Scanning He Ion Beam Microscopy and Metrology
David Joy, Univ. Tenn and ORNL

Novel Characterization Methods

Session Chair: Lori Nye, Brewer Science, Inc.

11:00 AM

A Novel SPM System for Determining the Quantum Electrical Structure of Nanometer-scale Systems such as Graphene
Joseph Stroscio, NIST

11:30 AM

Metrology for 3D Devices: Plasma-based FIB for High-throughput Sectioning of Large Dimensions
Noel Smith, Oregon Physics, US

12:00 PM

Time Resolved Cathodoluminescence
Jean-Daniel Ganiere, EPFL

12:30 PM

Lunch and Poster Viewing

2:00 PM

Quantitative High-resolution Depth Profiling of Light and Heavy Elements with Low-energy High-resolution ERDA
Timo Sajavaara. University of Jyväskylä, Finland

2:30 PM

Inelastic Electron Tunneling Spectroscopy for Measuring Microscopic Bonding Structures, Impurities, and Traps
T.P. Ma, Yale

CMOS Metrology

Session Chair: Yaw Obeng, NIST

3:00 PM

Metrology at IMEC: a Center of Excellence Enabling Fundamental Understanding of Process and Materials Development
Wilfried Vandervorst, IMEC

3:30 PM

Coffee Break and Dedicated Poster Viewing Session

5:00 PM

Strain Analysis in Scaled Si Transistors by Simulation-Hybrid UV Raman Microscopy
Toshihiko Kanayama, AIST

5:30 PM

Overview of Optical Metrology of Advanced Semiconductor Materials
Vimal Kamineni, CNSE

6:00 PM

Metrology Challenges for the Ultra-thin SOI
Oleg Kononchuk, SOITEC

6:45 PM

Depart MINATEC for Banquet

Thursday, May 26

Registration

8:00 AM – 8:30 AM

Interconnect Metrology

Session Chair: Scott List, Intel

8:30 AM

Metrology for 3D IC Integration (including TSV)
Ehrenfried Zschech, Fraunhofer Institute for Non-Destructive Testing

9:00 AM

Nanomechanical Characterization and Metrology for Low-k / ULK Materials
Ude Hangen, Hysitron

9:30 PM

Stress-induced Effects Caused by 3D IC TSV Packaging on Advanced Semiconductor Processes
Valeriy Sukharev, Mentor Graphics, San Jose/CA

10:00 AM

Coffee Break and Poster Viewing

Metrology for Patterning

Session Chair: Victor Vartanian, ISMI

10:30 AM

Overview of EUV Mask Metrology
Bryan Rice, SEMATECH

11:00 AM

3D-AFM Enhancement for CD Metrology Dedicated to 28 nm Node and Below Requirements
Johann Foucher, CEA-LETI

11:30 AM

Advances in CD-Metrology (CD-SAXS, Muller Matrix based Scatterometry, and SEM)
Brad Thiel, CNSE

12:00 PM

Line Edge Roughness of Directed Self Assembled PS-PMMA Block Copolymers – A Candidate for Future Lithography
Wen-li Wu, NIST

12:30 PM

Lunch and Poster Viewing

Next-Generation Defect Inspection

Session Chair: Dick Hockett, Evans Analytical Group Ltd.

2:00 PM

Fundamental Limits of Optical Defect Metrology
Richard Silver, NIST

2:30 PM

Wafer Inspection for Sub 20 nm Patterning
Wolf Staud, Applied Materials Inc., Israel

Characterization Needs and Methods for “More than Moore”

Session Chair: Herbert Bennett, NIST

3:00 PM

Positioning More Than Moore Characterization Needs and Methods Within the 2011 ITRS
Mart Graef, Delft Univ, Netherlands

3:30 PM

Coffee Break and Poster Viewing

4:00 PM

Measurements and Standards to Characterize More than Moore Applications of Electronics: Perspectives from KIT and IEC
Norbert Fabricius, Karlsruher Institut für Technologie (KIT)

4:30 PM

Thermal Properties Characterization of Advanced Materials for Nanoelectronics
Stefan Dilhaire, CNRS-CPMOH

5:00 PM

Frontiers of More than Moore in Bioelectronics and the Required Metrology Needs
Anthony Guiseppi-Elie, Clemson

5:30 PM – 6:30 PM

Poster Session (with Wine and Cheese)

 

Posters

Tuesday, May 24th

 

Wednesday, May 25th

 

Thursday, May 26th