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FEI Titan 80-300 STEM
- 300 keV, 200 keV and 80 keV accelerating voltages
- 0.136 nm point-to-point STEM resolution
- 0.19 nm point-to-point TEM resolution
- 1.8 nm Lorentz resolution
- ±45° specimen tilt
- Energy loss spectroscopy
- X-ray microanalysis
- Electron biprism for holography
- 2k CCD image acquisition
- Electron tomography holders
- Electron transport/biasing holder
- Analytical specimen holder
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JEOL JEM3010 UHR-TEM
- 300 keV accelerating voltage
- 0.17 nm point-to-point resolution
- ±15° specimen tilt
- Energy loss spectroscopy
- Energy-filtered imaging (atomic scale)
- X-ray microanalysis
- MSC-CCD image acquisition
- Scanning TEM capability
- High temperature holder
- Analytical specimen holder
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Hitachi S-4700-II FE-SEM
- 1 to 30 keV accelerating voltage
- 1.5 nm resolution at 30 keV
- 2.5 nm resolution at 1 keV
- 70° specimen tilt
- Electron back-scatter detector (CCD) system
- Phase ID capability
- X-ray microanalysis
- Specimen sizes up to 150 mm diameter wafer
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FEI CM30 TEM
- 300 keV accelerating voltage
- 0.22 nm point-to-point resolution
- ±40° specimen tilt
- X-ray microanalysis
- Parallel energy loss spectroscopy
- CCD camera
- High temperature double-tilt holder
- Low temperature single-tilt holder
- Analytical double-tilt holder
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JEOL JSM6400 SEM
- 5 to 30 keV accelerating voltage
- 5 nm resolution at 30 keV
- Electron back-scatter detector system
- Phase ID capability
- >70° specimen tilt
- X-ray microanalysis
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Specimen Preparation
- VCR Dimpler
- Dimple Grinder
- Tripod wedge polishers
- Precision ion-polishing system (PIPS)
- XLA2000 low angle ion mill (w/cold stage, ion termination)
- Duo ion mill (w/LN2 cold stage)
- Ultrasonic disc cutter
- Diamond blade wafer cutter
- Optical microscopes with digital image acquisition
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Image Analysis
- PC and Mac workstations
- Accelrys image simulation software
- 4800 ppi (14-bit) image scanner
- Dye-sublimation printers
- Lots o' software
- Coffee...
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