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The MML Microscopy Facility is administered by the Materials Science and Engineering Division of the Material Measurement Laboratory. The facility includes: three TEMs, three SEMs, specimen preparation equipment, and an image analysis center.

 
MSEL Titan STEM

 

 FEI Titan 80-300 STEM
  • 300 keV, 200 keV and 80 keV accelerating voltages
  • 0.136 nm point-to-point STEM resolution
  • 0.19 nm point-to-point TEM resolution
  • 1.8 nm Lorentz resolution
  • ±45° specimen tilt
  • Energy loss spectroscopy
  • X-ray microanalysis
  • Electron biprism for holography
  • 2k CCD image acquisition
  • Electron tomography holders
  • Electron transport/biasing holder
  • Analytical specimen holder
JEOL JEM3010 TEM

 

 JEOL JEM3010 UHR-TEM
  • 300 keV accelerating voltage
  • 0.17 nm point-to-point resolution
  • ±15° specimen tilt
  • Energy loss spectroscopy
  • Energy-filtered imaging (atomic scale)
  • X-ray microanalysis
  • MSC-CCD image acquisition
  • Scanning TEM capability
  • High temperature holder
  • Analytical specimen holder
 Hitachi S4700 FE-SEM
 Hitachi S-4700-II FE-SEM
  • 1 to 30 keV accelerating voltage
  • 1.5 nm resolution at 30 keV
  • 2.5 nm resolution at 1 keV
  • 70° specimen tilt
  • Electron back-scatter detector (CCD) system
  • Phase ID capability
  • X-ray microanalysis
  • Specimen sizes up to 150 mm diameter wafer
 FEI CM30 TEM  FEI CM30 TEM
  • 300 keV accelerating voltage
  • 0.22 nm point-to-point resolution
  • ±40° specimen tilt
  • X-ray microanalysis
  • Parallel energy loss spectroscopy
  • CCD camera
  • High temperature double-tilt holder
  • Low temperature single-tilt holder
  • Analytical double-tilt holder
 JEOL JSM6400 SEM  JEOL JSM6400 SEM
  • 5 to 30 keV accelerating voltage
  • 5 nm resolution at 30 keV
  • Electron back-scatter detector system
  • Phase ID capability
  • >70° specimen tilt
  • X-ray microanalysis
 Specimen preparation for microscopy  Specimen Preparation
  • VCR Dimpler
  • Dimple Grinder
  • Tripod wedge polishers
  • Precision ion-polishing system (PIPS)
  • XLA2000 low angle ion mill (w/cold stage, ion termination)
  • Duo ion mill (w/LN2 cold stage)
  • Ultrasonic disc cutter
  • Diamond blade wafer cutter
  • Optical microscopes with digital image acquisition
 image analysis software  Image Analysis
  • PC and Mac workstations
  • Accelrys image simulation software
  • 4800 ppi (14-bit) image scanner
  • Dye-sublimation printers
  • Lots o' software
  • Coffee...