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David Read

Research Interests:

Mechanical properties of thin films, fracture mechanics, high resolution experimental mechanics, test methods for mechanical and electrical reliability of interconnects, molecular dynamics


Professional Affiliations:

Materials Research Society (MRS)

American Physical Society (APS)

American Society for Testing and Materials (ASTM)


Professional Activities:

Organizer, Workshop on Materials Characterization for Nanoscale Reliability, NIST (2007)

Organizer, Workshop on Reliability Issues in Nanomaterials, NIST (2004)

Member of Steering Committee, Workshop on Materials for Electronic Packaging and Interconnects (1990, 1994)

Member, Research Advisory Committee, NIST (1992 to 1994)

Co-chair, 18th National Symposium on Fracture Mechanics (1985)


Awards and Honors:

Society for Experimental Mechanics – Hetenyi Award for Best Paper in Experimental Mechanics (1993)

U.S. Department of Commerce Bronze Medal (1991)

NIST Director’s Innovation Award (1989)

NBS – Sustained Superior Performance (1976)

NBS - National Research Council Postdoctoral Fellowship (1974-1975)

NSF Summer Student Traineeship, University of Illinois at Urbana(1970)




Materials Reliability Division
Nanoscale Reliability Group

Employment History:

2007 to present: Project Leader, Thin Film & Interconnect Reliability, Materials Reliability Division, NIST

1989 to present: Physicist, Materials Reliability Division, NIST

1988: Guest Scientist, GKSS Research Institute, Geesthacht, Germany

1975 to 1988: Physicist, Fracture and Deformation Division, NIST/NBS

1974 to 1975: National Research Council Post-Doctoral Fellow, Fracture and Deformation Division, NBS


Ph.D., Engineering Physics, University of Illinois at Urbana-Champaign, 1975

M.S., Engineering Physics, University of Illinois at Urbana-Champaign, 1971

B.S., Physics, University of Santa Clara, 1969


Phone: 303-497-3853
Email: read@boulder.nist.gov
Fax: 303-497-5030