The Nanoscale Metrology (NM) Group of the Precision Engineering Division (PED), one of five divisions of the Manufacturing Engineering Laboratory (MEL) at the National Institute of Standards and Technology (NIST), supports the division's mission with a concentration on measurements of one nanometer to one micrometer. Measurements are made by tunneling, atomic-force, electron, and visible- and ultraviolet-light microscopies. The group places special emphasis on satisfying the advanced needs of U.S. microelectronic manufacturing industries.

Atom-Based Standards and Fabrication — A primary goal of this project is to develop intrinsic calibration standards based on the crystalline lattice. The ultimate limit for nanoscale length metrology is the development of intrinsic …
Atomic Force Microscope (AFM) Nanoparticle Metrology — The largest existing market for nanotechnology centers on production and use of nanoparticles and nanocomposites. The NextGen Program is developing techniques for fixing soft, bio-mimetic …
High-Throughput Nanometrology with Scatterfield Microscopy — Develop optical methods with extremely high throughput rates to accurately measure nanoscale features and objects. High-throughput is a requirement for effective control of manufacturing processes …
Nanomanufacturing Metrology Program — By 2015, products incorporating nanoscale materials and devices are predicted to account for 15 percent of global manufacturing out. Spanning industries from aerospace and automotive to chemicals …
Nanoparticle Manipulation Metrology — The Nanoparticle Manipulation Metrology Project will develop an optical tweezers system for the trapping and manipulation of nanoparticles.
Next-Generation Nanometrology Program — Meeting the electronics industry's rallying cry for ever smaller and faster components requires more than improvements in manufacturing techniques: engineers must be able to see and measure …
Optical Linescale Metrology — The cornerstone of traceability for the SI Unit of length, the meter, is the Linescale Interferometer (LSI) which provides World-class one-dimensional scale calibrations traceable to the SI as …
Overlay Instrument and Wafer Target Designs — A modern semiconductor chip has an enormous number of densely packed features that can measure smaller than 30 nanometers wide, built up in layers during as many as 27 lithographic process steps. …
Photomask Dimensional Metrology — Measurement of linewidth or critical dimension (CD) continues to be one of the most fundamental dimensional metrology needs in the semiconductor and nanomanufacturing …
Scanning Particle-Beam Microscope Innovations — The work at the Scanning Particle-Beam Microscope Project is aimed at the development of the best-in-the-world scanning electron and ion microscopy and related dimensional metrology. This includes …
Wafer Level SEM Metrology for Critical Dimension Measurements — In the semiconductor manufacturing industry, microscopes are used to measure feature linewidths of a few tens of nanometers for process monitoring and control At this scale, the largest component …