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|Author(s):||Ravi Kummamuru; Lito De La Rama; Liang Hu; Mark D. Vaudin; Mikhail Efremov; Martin L. Green; David A. LaVan; Leslie Allen;|
|Title:||Measurement of heat capacity and enthalpy of formation of Nickel Silicide using Nano-calorimetry|
|Published:||November 02, 2009|
|Abstract:||We present characterization of energetics of the reaction between nickel and silicon thin films using differential scanning nano-calorimetry (nano-DSC). For the first time, nano-DSC measurements up to 850 °C and of enthalpy of thin film reactions have been performed. A large exothermic dip in heat capacity attributed to nickel silicide formation is found along with indications of two phase changes at 430 °C and 550 °C. Heating rate reaches 10^6 K/s during the reaction. The total enthalpy of reaction and heat capacity at various stages of the experiment were quantitatively measured. The post-reaction phases were identified using electron backscattered diffraction (EBSD). Samples with 17 nm Ni and 25 nm Si films deposited (Ni/Si molar ratio of 1.2) and heated to 850 °C were found to contain a mixture of NiSi and the theta- nickel silicide (hexagonal - Ni2Si) phase, while samples heated to a lower temperature (790 °C) result in predominantly NiSi.|
|Citation:||Applied Physics Letters|
|Keywords:||nanocalorimeter, nanocalorimetry, thin film, nickel, silicon, silicide, formation, thin film, reaction|
|Research Areas:||Nanometrology, Thin-Films, Semiconductor Materials, Nanomaterials, Thermodynamics and kinetics|
|PDF version:||Click here to retrieve PDF version of paper (388KB)|