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|Author(s):||Chad R. Snyder; F I. Mopsik;|
|Title:||High Sensitivity Technique for Measurement of Thin Film Out-of-Plane Expansion|
|Published:||March 01, 1998|
|Abstract:||We have developed a technique utilizing a capacitance measurement for the accurate determination of the out-of-plane expansion of thin films on the order of 1 micrometer thick. This is important because the coefficient of thermal expansion (CTE) is a key parameter for the design and reliability of polymer containing products. Due to the drive towards denser packages and the use of thin polymeric films as inner-layer dielectrics (ILDs), a technique is required that can make precision measurements of the CTE of thin films. The current technique, thermomechanical analysis (TMA), has been demonstrated by a multi-user round-robin test to be inadequate for such measurements. The absolute measurement technique that we have developed is based upon a parallel plate three-terminal guarded electrode.|
|Conference:||AIP Conference Proceedings|
|Proceedings:||Characterization and Metrology for ULSI Technology: 1998 International Conference|
|Dates:||March 23-27, 1998|
|Keywords:||absolute measurement,capacitance,coefficient of thermal expansion,swelling,thin film,z-axis expansion|
|Research Areas:||Polymers, Electronics|
|PDF version:||Click here to retrieve PDF version of paper (1MB)|