| Author(s): |
Chad R. Snyder; F I. Mopsik; |
| Title: |
High Sensitivity Technique for Measurement of Thin Film Out-of-Plane Expansion |
| Published: |
March 01, 1998 |
| Abstract: |
We have developed a technique utilizing a capacitance measurement for the accurate determination of the out-of-plane expansion of thin films on the order of 1 micrometer thick. This is important because the coefficient of thermal expansion (CTE) is a key parameter for the design and reliability of polymer containing products. Due to the drive towards denser packages and the use of thin polymeric films as inner-layer dielectrics (ILDs), a technique is required that can make precision measurements of the CTE of thin films. The current technique, thermomechanical analysis (TMA), has been demonstrated by a multi-user round-robin test to be inadequate for such measurements. The absolute measurement technique that we have developed is based upon a parallel plate three-terminal guarded electrode. |
| Conference: |
AIP Conference Proceedings |
| Proceedings: |
Characterization and Metrology for ULSI Technology: 1998 International Conference |
| Volume: |
449 |
| Dates: |
March 23-27, 1998 |
| Keywords: |
absolute measurement;capacitance;coefficient of thermal expansion;swelling;thin film;z-axis expansion |
| Research Areas: |
Polymers, Electronics |
| PDF version: |
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