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Publication Citation: Chip-Scale Atomic Frequency References: Fabrication and Performance

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Author(s): John E. Kitching; Svenja A. Knappe; Li-Anne Liew; John M. Moreland; Hugh Robinson; Peter D. Schwindt; V Shah; V Gerginov; Leo W. Hollberg;
Title: Chip-Scale Atomic Frequency References: Fabrication and Performance
Published: December 01, 2005
Abstract: The physics package for a chip-scale atomic frequency reference was constructed and tested. The device has a total volume of 9.5 mm3, dissipates 75 mW of electrical power at an ambient temperature of 45 °C and has a short-term fractional frequency instability of 2.4×10-10/√υ. Advanced cell fabrication techniques indicate a long-term instability near 1-^-11^ may be feasible.
Conference: 19th European Frequency and Time Forum
Pages: pp. 575 - 580
Location: Besancon, FR
Keywords: Atomic;clock;compact;microfabrication;wafer bonding
Research Areas: Electromagnetics