| Author(s): |
John E. Kitching; Svenja A. Knappe; Li-Anne Liew; John M. Moreland; Hugh Robinson; Peter D. Schwindt; V Shah; V Gerginov; Leo W. Hollberg; |
| Title: |
Chip-Scale Atomic Frequency References: Fabrication and Performance |
| Published: |
December 01, 2005 |
| Abstract: |
The physics package for a chip-scale atomic frequency reference was constructed and tested. The device has a total volume of 9.5 mm3, dissipates 75 mW of electrical power at an ambient temperature of 45 °C and has a short-term fractional frequency instability of 2.4×10-10/√υ. Advanced cell fabrication techniques indicate a long-term instability near 1-^-11^ may be feasible. |
| Conference: |
19th European Frequency and Time Forum |
| Pages: |
pp. 575 - 580 |
| Location: |
Besancon, FR |
| Keywords: |
Atomic;clock;compact;microfabrication;wafer bonding |
| Research Areas: |
Electromagnetics |
