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Publication Citation: Thermal Component Models for Electro-Thermal Analysis of Multichip Power Modules

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Author(s): J J. Rodriguez; John V. Reichl; Zharadeen R. Parrilla; Allen R. Hefner Jr; David W. Berning; M Velez-Reyes; Jih-Sheng Lai;
Title: Thermal Component Models for Electro-Thermal Analysis of Multichip Power Modules
Published: October 24, 2002
Abstract: Thermal component models are developed for multi-chip IGBT power electronic modules (PEM) and associated high-power converter heatsinks. The models are implemented in SABER and are combined with the electro-thermal IGBT and diode models to simulate the electro-thermal performance of high power converter systems. The thermal component models are parameterized in terms of structural and materials parameters so that they can be readily used to develop a library of component models for the various commercially available power modules. The paper presents model development and implementation in SABER, simulation results, and validation using experimental data.
Conference: IEEE Industrial Applications Society Meeting
Proceedings: Proc., 2002 IEEE Industry Application Society
Pages: pp. 234 - 241
Location: Pittsburgh, PA
Dates: October 13-18, 2002
Keywords: IGBT; multi-chip power modules; thermal simulation;thermal model;
Research Areas: Electronics & Telecommunications
PDF version: PDF Document Click here to retrieve PDF version of paper (794KB)