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|Author(s):||J J. Rodriguez; John V. Reichl; Zharadeen R. Parrilla; Allen R. Hefner Jr.; David W. Berning; M Velez-Reyes; Jih-Sheng Lai;|
|Title:||Thermal Component Models for Electro-Thermal Analysis of Multichip Power Modules|
|Published:||October 24, 2002|
|Abstract:||Thermal component models are developed for multi-chip IGBT power electronic modules (PEM) and associated high-power converter heatsinks. The models are implemented in SABER and are combined with the electro-thermal IGBT and diode models to simulate the electro-thermal performance of high power converter systems. The thermal component models are parameterized in terms of structural and materials parameters so that they can be readily used to develop a library of component models for the various commercially available power modules. The paper presents model development and implementation in SABER, simulation results, and validation using experimental data.|
|Conference:||IEEE Industrial Applications Society Meeting|
|Proceedings:||Proc., 2002 IEEE Industry Application Society|
|Pages:||pp. 234 - 241|
|Dates:||October 13-18, 2002|
|Keywords:||IGBT, multi-chip power modules, thermal simulation,thermal model|
|Research Areas:||Electronics & Telecommunications|
|PDF version:||Click here to retrieve PDF version of paper (794KB)|