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Publication Citation: Microtomography of an integrated circuit interconnect with an electromigration void

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Author(s): Zachary H. Levine; A R. Kalukin; M Kuhn; S P. Frigo; I McNulty; C C. Retsch; Ying-ju Wang; Uwe Arp; Thomas B. Lucatorto; B D. Ravel; Charles S. Tarrio;
Title: Microtomography of an integrated circuit interconnect with an electromigration void
Published: January 01, 2000
Abstract:
Citation: Journal of Applied Physics
Volume: 87
Research Areas: