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Back-End-of-Line Tools

Perform post-processing with a Bruker-TMT CP-4 chemical mechanical polisher, a Disco 341 200 mm wafer dicing saw, a Kulicke & Soffa 4526 semi-automatic wire bonder, a critical point dryer, and a Tresky T-3000 flip-chip bonder. 

Flip Chip Bonder: Tresky T-3000-FC3-HF

This table-top bonder is capable of bonding various types of chips, semiconductor and others, place solder preforms, and dispense solder pastes and epoxies, onto various types of substrates, such as semiconductor packages, submounts, as well as entire wafers. It is equipped with a camera-based vision system and display to precisely align the parts to be bonded together.

Features:Tresky T-3000-FC3-HF
  • X and Y motion range: 200 mm. Can handle up to 150 mm wafer
  • Substrate thickness up to 40 mm
  • Die positioning accuracy: 1 µm
  • Side-view camera for direct observation of bonding process
  • Attach chips to semiconductor, opto-electronic, and other packages
  • Eutectic, ultrasonic, thermo-compression, and epoxy bonding

Wafer Dicing Saw: Disco Model 341

Applications:Wafer dicing saw
  • Full wafer dicing
  • Auto cutting and semi-auto cutting modes
  • Used to dice silicon, sapphire, ceramic, metals, Pyrex, glass, epoxy substrates.
  • Maximum material thickness < 0.50 in
  • Used for dicing photomasks, wafers, creating channels, troughs, gratings, ramps and sample preparation.
Sample Size: Pieces up to 200 mm (8 in) wafers

Restrictions: Approved training required.

Wire Bonder: Kulicke and Soffa Model 4526

Applications:Wire Bonder
  • Wedge bonder
  • Semi-automatic and manual modes
  • Independent Z-axis control, separate from X and Y axis control
  • Force, power and time independently adjustable on each bond
  • Auto step back with motorized Y stage for precise wire length and loop formation
  • Wire sizes 18 - 75 micrometers (0.0007-0.003") diameter, gold and aluminum
  • Ribbon sizes up to 25 micrometers x 250 micrometers (0.001 inx 0.010 in) in gold
  • Electrical access to micro- and nano-devices, micro-electronic packaging

Critical Point Dryer

This system utilizes CO2 to dry fragile suspended and floating structures

  • Wafer size up to 150 mm (6 in).critical point dryer
Applications: This tool, when used for the CO2 dry release after wet etching, provides the most beneficial process for reducing stiction and increasing yield of suspended and floating structures

Demonstrated use: MEMS drying, Membrane drying

Chemical Mechanical Polisher (CMP): Bruker-TMT (formerly CETR) model CP-4

The CMP removes material using a corrosive colloidal slurry along with a dynamic polishing head with different nonconcentric axes of rotation. The system removes irregular topography and leaves wafers or other samples planar.

Features:Chemical Mechanical Polisher
  • Sample sizes: 25 mm x 25 mm or 50 mm x 50 mm (1 in x 1 in or 2 in x 2 in) and 75 mm-diameter and 100 mm-diameter (3 in and 4 in) wafers
  • Variable speed: 0.1 to 500 rpm on both wafer and polishing pads
  • Laterally oscillating wafer pad
  • Down force: 0.4 to 400 N
  • In-situ pad conditioning
  • Measures coefficient of friction, acoustic emission wear rate, pad temperature, down force, shear force
  • Slurry pump and water pump: 5 to 400 ml/min
  • Planarization after within-layer interconnects: typically Cu, W, Al, Pt
  • Planarization after inter-layer isolation: typically SiO2
  • General sample polishing

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