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NanoFab Tool: Suss MicroTec MA6/BA6 Contact Aligner


The Suss MicroTec MA6 contact aligner allows users to align patterns on the front or back of a substrate and to print feature sizes down to 1 µm. The tool offers a variety of exposure methods with overlay accuracy better than 500 nm. It can accommodate substrates ranging from 150 mm diameter wafers down to small pieces.

  • Exposure methods: flood, proximity, soft, hard, low vacuum and vacuum contacts.
  • Exposure wavelengths:
    • UV broadband (350 nm to 450 nm).
    • I-line (365 nm band-pass filter).
    • G-line (436 nm band-pass filter).
  • Illumination area: 150 mm diameter.
  • Resolution: 1 µm.
  • Overlay accuracy: ≤ 500 nm.
  • Front and back side pattern alignment.
Supported Sample Sizes:
  • Maximum wafer diameter: 150 mm (6 in).
  • Small pieces supported: Yes.
  • Maximum substrate thickness: 6 mm.
  • Mask sizes supported:
    • 63 mm x 63 mm.
    • 102 mm x 102 mm.
    • 127 mm x 127 mm.
    • 178 mm x 178 mm.
Typical Applications:
  • Medical devices.
  • Biofluidic devices.
  • Microelectromechanical systems.
  • Thermal sensors.
  • Printing micrometer size and larger features.
Photograph of the Suss MicroTec MA6/BA6 Contact Aligner System.

NEMO Name: Suss MA6

Location: Building 215 Rm. A102 (Cleanroom)

Hours of Operation:

Cleanroom hours

Tool Reservation Rules:
  • Minimum Reservation Time: 30 minutes.
  • Maximum Reservation Time: 4 hours.
  • Adjacent Reservations Permitted: No.
  • Cancelation Policy: Reservations must be canceled at least 12 hours before the scheduled start time.
  • Restrictions: 12 hours advance notice required for filter installation.
Hourly Rate:
Standard Reduced
$87 $47
Training Hourly Rate:
Individual Group
$181 $91

Training Time: Depends on user experience and process requirements; typically 3 hours.


Liya Yu, Primary Engineer

Marc Cangemi, Backup Engineer

100 Bureau Drive, Stop 6201
Gaithersburg, MD 20899-6201