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The Suss MicroTec MA6 contact aligner allows users to align patterns on the front or back of a substrate and to print feature sizes down to 1 µm. The tool offers a variety of exposure methods with overlay accuracy better than 500 nm. It can accommodate substrates ranging from 150 mm diameter wafers down to small pieces.
NEMO Name: Suss MA6
Location: Building 215 Rm. A102 (Cleanroom)
Training Time: Depends on user experience and process requirements; typically 3 hours.