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New and Upcoming NanoFab Capabilities

The CNST has acquired a range of new tools which will become available to NanoFab users in the coming months.

Direct Write E-Beam Lithography System Now Available

A new JEOL 6300-FS direct write electron beam lithography system has been installed in the clean room, doubling the NanoFab’s capability in e-beam lithography. The new state-of-the-art system offers high resolution exposure capability and accommodates batch handling of substrates.  The system is available to users through the NEMO system.

For additional information, contact Rich Kasica, 301-975-2693, rkasica@nist.gov.


Deep Silicon Etcher Now Available

The CNST has purchased a new SPTS Omega c2L deep silicon etcher (DSE) which is now available to users in the NanoFab cleanroom. The new DSE can handle up to 200 mm diameter silicon wafer and can etch faster than the current deep silicon etcher in NanoFab. This new DSE also can provide smoother sidewall and better end point detection. This tool can be used to fabricate three-dimensional structures in silicon (Si) with vertical sidewalls of very high aspect ratio (> 50:1). Applications include fabricating micro/nano electro mechanical systems (MEMS/NEMS) such as accelerometers, ink jet heads, pressure sensors, gyroscopes, microphones, microactuators, and lab-on-chip devices.

For additional information, contact Lei Chen, 301-975-2908, lei.chen@nist.gov.


Lithography Coater System Now Available

A new Suss Microtec ASC200 Gen 3 automated resist coater is now available to users in the NanoFab cleanroom.  This system is able to perform spray and spin resist coating with automated wafer handling and resist baking. It is designed to be able
to apply high quality resist film on a wide range of substrate shapes, sizes and topologies with consistent and uniform results. This new lithography resist coater enhances the quality, repeatability and throughput of NanoFab precision lithographic imaging.

For additional information, contact Liya Yu, 301-975-4590, liya.yu@nist.gov.


Sputter Cluster System — Available January 2015

The CNST has received delivery of the 4-Wave Sputtering Cluster System (SCS). Installation is underway and the tool is expected to be available to users by January 2015. This tool will provide users physical deposition capability using the ion beam deposition or biased target deposition techniques resulting in the densest available thin films deposited at room temperature. The SCS has cassette-to-cassette and robot wafer handling, a load lock, and 12 ready-to-deposit materials to provide users clean films deposited on substrates ranging from small pieces up to 200 mm diameter wafers.

For additional information, contact Gerard Henein, 301-975-5645, gerard.henein@nist.gov.


High Resolution Field Emission Scanning Electron Microscope — Coming Spring 2015

The CNST has purchased a JEOL JSM-7800F FESEM which will be installed in the NanoFab cleanroom in spring 2015. The JSM-7800F is a research grade, extremely high resolution thermal Schottky type SEM which provides high resolution imaging for any type of sample. It also maintains long-term beam stability for analysis, as well as high beam currents, high resolution, and low kV high resolution imaging. This is a high performance FESEM that can be used to observe the finest structural morphology of nanomaterials at 1,000,000× magnification with better than 1 nm resolution. It has excellent low voltage imaging capability enabling users to image resist coated wafers, quartz wafers and other non-conducting samples without a conductive coating. It will be able to handle wafers up to 200 mm in diameter and obtain images from the entire wafer. The FESEM will be located in the NanoFab cleanroom to allow easy imaging of wafer between process steps as well as imaging routine samples.

For additional information, please contact Kerry Siebein, 301-975-8458, kerry.siebein@nist.gov.


Single Wafer Spray Acid System — Coming Spring 2015

The CNST has purchased three SSEC model 3300ML spray acid cleaning systems to support RCA and Piranha processes in the NanoFab cleanroom. The tools are expected to be installed in spring 2015. These tools will provide automated single wafer cleaning process without exposing users to chemicals. They will replace the current immersion cleaning process to eliminate cross contamination between wafers, providing better wafer cleaning capability. The three systems can accommodate substrates ranging from 200 mm diameter wafers to small pieces. In addition, the tools are capable of delivering, mixing, and heating chemical solutions on demand.

For additional information, contact Jessie Zhang, 301-975-4565, chen.zhang@nist.gov.


Sheet Resistance Mapping System — Coming January 2015

The CNST has purchased a Four Dimensions 280DI 4-point probe sheet resistance mapping system which is expected to be available to users January 2015. The tool will use the four point probe technique to measure sheet resistances ranging from 800 GΩ down to 1 mΩ. The automated stage and software provide mapping measurement capability of up to 5000 points per wafer on substrates ranging from 200 mm diameter wafers down to 25 mm diameter wafers with a measurement speed of a few seconds per point.

For additional information, contact Gerard Henein, 301-975-5645, gerard.henein@nist.gov.


Downstream Plasma Asher System — Coming Spring 2015

The CNST has purchased an ULVAC Solutions ENVIRO-1Xa downstream plasma asher which will be available to users in spring 2015. The downstream plasma asher will remove more than 1 µm of photoresist per minute and clean substrates without damaging their surfaces. The tool forms the plasma remotely and, to protect the surfaces, the desired particles are channeled to the wafer to insure that the highest energy ions in the plasma do not impact the substrate.

For additional information please contact Marc Cangemi, 301-975-5993, marc.cangemi@nist.gov.


Rapid Thermal Annealer — Coming Spring 2015

The CNST has purchased an AnnealSys AS-Master 2000 HT rapid thermal annealing tool for delivery in spring 2015. The new tool will provide improved annealing performance to users seeking to minimize the thermal budgets in their fabrication processes. An increased range of non-contact temperature control from 150 °C up to 1500 °C and ramp rates as high as 200 °C / s will be available while maintaining uniform heating across substrates ranging from 200 mm diameter wafers down to small pieces. The tool will be ideal for dopant activation while maintaining shallow junctions, thin film annealing, silicide formation, and oxidation.

For additional information please contact Jerry Bowser, 301-975-8187, jerry.bowser@nist.gov.


Acid Fume Hood — Coming Spring 2015

The CNST plans to purchase a new acid wet bench which will arrive in spring 2015 and replace the existing general purpose acid bench in cleanroom. The bench will support three simultaneous users and each position will be equipped with an electronic timer, integrated stirring hot plate, sink, glove rinse, nitrogen gun, aspirator, deionized water spray and work surface capable of handling substrates ranging from 200 mm diameter wafers down to small pieces.

For additional information please contact Vince Luciani, 301-975-2886, vincent.luciani@nist.gov.