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New and Upcoming NanoFab Capabilities

The CNST has acquired a range of new tools which will become available to NanoFab users in the coming months.

Downstream Plasma Asher System — Now Available

The CNST has purchased and installed an ULVAC Solutions ENVIRO-1Xa downstream plasma asher which is now available to users. The downstream plasma asher will remove more than 1 µm of photoresist per minute and clean substrates without damaging their surfaces. The tool forms the plasma remotely and, to protect the surfaces, the desired particles are channeled to the wafer to insure that the highest energy ions in the plasma do not impact the substrate.

For additional information please contact Marc Cangemi, 301-975-5993, marc.cangemi@nist.gov.


Profilometer System - Now Available

The CNST has added a second Bruker Dektak XT profilometer with a motorized X-Y-Θ stage, replacing the older Dektak 6M.In addition to providing step height, surface roughness and waviness measurements, the new profilometer offers wafer mapping and 3-D topological imaging. It can handle small samples and wafers up to 200 mm in diameter. 

For additional information please contact Gerard Henein, 301-975-5645, gerard.henein@nist.gov.


High Resolution Field Emission Scanning Electron Microscope — Coming July 2016

The CNST has purchased a JEOL JSM-7800F FESEM which will be installed in the NanoFab cleanroom in July 2016. The JSM-7800F is a research grade, extremely high resolution thermal Schottky type SEM which provides high resolution imaging for any type of sample. It also maintains long-term beam stability for analysis, as well as high beam currents, high resolution, and low kV high resolution imaging. This is a high performance FESEM that can be used to observe the finest structural morphology of nanomaterials at 1,000,000× magnification with better than 1 nm resolution. It has excellent low voltage imaging capability enabling users to image resist coated wafers, quartz wafers and other non-conducting samples without a conductive coating. It will be able to handle wafers up to 200 mm in diameter and obtain images from the entire wafer. The FESEM will be located in the NanoFab cleanroom to allow easy imaging of wafer between process steps as well as imaging routine samples.

For additional information, please contact Kerry Siebein, 301-975-8458, kerry.siebein@nist.gov.


Single Wafer Spray Acid System — Coming July 2016

The CNST has purchased three SSEC model 3300ML spray acid cleaning systems to support RCA and Piranha processes in the NanoFab cleanroom. The tools are expected to be installed in July 2016. These tools will provide automated single wafer cleaning process without exposing users to chemicals. They will replace the current immersion cleaning process to eliminate cross contamination between wafers, providing better wafer cleaning capability. The three systems can accommodate substrates ranging from 200 mm diameter wafers to small pieces. In addition, the tools are capable of delivering, mixing, and heating chemical solutions on demand.

For additional information, contact Matt Robinson, 301-975-2421, matthew.robinson@nist.gov.


Rapid Thermal Annealer — Coming July 2016

The CNST has purchased an AnnealSys AS-Master 2000 HT rapid thermal annealing tool which will be installed in the cleanroom in July 2016. The new tool will provide improved annealing performance to users seeking to minimize the thermal budgets in their fabrication processes. An increased range of non-contact temperature control from 150 °C up to 1500 °C and ramp rates as high as 200 °C / s will be available while maintaining uniform heating across substrates ranging from 200 mm diameter wafers down to small pieces. The tool will be ideal for dopant activation while maintaining shallow junctions, thin film annealing, silicide formation, and oxidation.

For additional information please contact Robert Newby, 301-975-6070, robert.newby@nist.gov.


Acid Fume Hood — Now Available

The CNST has purchased a new acid wet bench to replace the existing general purpose acid bench in cleanroom which is now available to users. The bench will support three simultaneous users and each position will be equipped with an electronic timer, integrated stirring hot plate, sink, glove rinse, nitrogen gun, aspirator, deionized water spray and work surface capable of handling substrates ranging from 200 mm diameter wafers down to small pieces.

For additional information please contact Liya Yu, 301-975-4590, liya.yu@nist.gov


FEI Helios FIB Upgrades – Coming Summer 2016

The CNST NanoFab plans to add new capabilities to the Helios 650 DualBeam microscopes including two new types of electron detectors and a multiple gas injection system. The new detectors will allow the capture and differentiation of low-loss and no-loss backscatter electrons (BSE), which are important for discriminating between materials of very similar composition, including composites. The new detectors can be used with the current detectors, enabling simultaneous secondary electron and BSE imaging. The multiple gas injection system adds precise control of gas flow, gas needle location, and gas mixing capabilities to the current direct beam-induced deposition systems.

For additional information please contact Joshua Schumacher, 301-975-8065, joshua.schumacher@nist.gov


Silane Vapor Deposition Tool – Coming Summer 2016

The CNST NanoFab has purchased a silane vapor deposition tool use in the soft lithography laboratory and should be available to users in summer 2016. The silane vapor deposition tool will be capable of depositing a monolayer of silane based chemicals on the surface of a PDMS master to prevent adhesion between the PDMS and the master.  This tool is recommended for applications related to thin film casting, high aspect ratio features fabrication and other highly intricate and delicate masters.  A dedicated silanization tool will provide safe operation for users and prevent exposure to the hazard material. The tool will support substrates ranging from 150 mm down to small pieces. 

For additional information please contact Jessie Zhang, 301-975-4565, chen.zhang@nist.gov.


PDMS Mixing Tool – Now Available

The CNST NanoFab has purchased a PDMS mixing tool for use in the soft lithography laboratory which is now available to users. The mixer will provide rapid and thorough mixing of the PDMS components with precise speed control thus producing more repeatable films. 

For additional information please contact Robert Newby, 301-975-6070, robert.newby@nist.gov.


PDMS Puncher – Now Available

The CNST NanoFab has purchased a PDMS puncher for use in the soft lithography laboratory which is now available to users. The puncher, when setup together with a microscope will provide precise arrays of holes in PDMS films for multilayer microfluidics device development and fabrication. 

For additional information please contact Robert Newby, 301-975-6070, robert.newby@nist.gov.


Acid and Solvent Wet Benches – Coming Summer 2016 

The CNST has purchased new acid and solvent wet benches which will replace the existing general purpose benches in the cleanroom. Each new bench will support three simultaneous users equipped with an electronic timer, integrated stirring hot plate, sink, glove rinse, nitrogen gun, aspirator, deionized water spray and work surface capable of handling substrates ranging from 200 mm diameter wafers down to small pieces.

For additional information please contact Liya Yu, 301-975-4590, liya.yu@nist.gov