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New and Upcoming NanoFab Capabilities

The CNST has acquired a range of new tools which will become available to NanoFab users in the coming months.

High Resolution Field Emission Scanning Electron Microscope — Coming Spring 2015

The CNST has purchased a JEOL JSM-7800F FESEM which will be installed in the NanoFab cleanroom in spring 2015. The JSM-7800F is a research grade, extremely high resolution thermal Schottky type SEM which provides high resolution imaging for any type of sample. It also maintains long-term beam stability for analysis, as well as high beam currents, high resolution, and low kV high resolution imaging. This is a high performance FESEM that can be used to observe the finest structural morphology of nanomaterials at 1,000,000× magnification with better than 1 nm resolution. It has excellent low voltage imaging capability enabling users to image resist coated wafers, quartz wafers and other non-conducting samples without a conductive coating. It will be able to handle wafers up to 200 mm in diameter and obtain images from the entire wafer. The FESEM will be located in the NanoFab cleanroom to allow easy imaging of wafer between process steps as well as imaging routine samples.

For additional information, please contact Kerry Siebein, 301-975-8458, kerry.siebein@nist.gov.


Single Wafer Spray Acid System — Coming Spring 2015

The CNST has purchased three SSEC model 3300ML spray acid cleaning systems to support RCA and Piranha processes in the NanoFab cleanroom. The tools are expected to be installed in spring 2015. These tools will provide automated single wafer cleaning process without exposing users to chemicals. They will replace the current immersion cleaning process to eliminate cross contamination between wafers, providing better wafer cleaning capability. The three systems can accommodate substrates ranging from 200 mm diameter wafers to small pieces. In addition, the tools are capable of delivering, mixing, and heating chemical solutions on demand.

For additional information, contact Jessie Zhang, 301-975-4565, chen.zhang@nist.gov.


Downstream Plasma Asher System — Coming Spring 2015

The CNST has purchased an ULVAC Solutions ENVIRO-1Xa downstream plasma asher which will be available to users in spring 2015. The downstream plasma asher will remove more than 1 µm of photoresist per minute and clean substrates without damaging their surfaces. The tool forms the plasma remotely and, to protect the surfaces, the desired particles are channeled to the wafer to insure that the highest energy ions in the plasma do not impact the substrate.

For additional information please contact Marc Cangemi, 301-975-5993, marc.cangemi@nist.gov.


Rapid Thermal Annealer — Coming Spring 2015

The CNST has purchased an AnnealSys AS-Master 2000 HT rapid thermal annealing tool for delivery in spring 2015. The new tool will provide improved annealing performance to users seeking to minimize the thermal budgets in their fabrication processes. An increased range of non-contact temperature control from 150 °C up to 1500 °C and ramp rates as high as 200 °C / s will be available while maintaining uniform heating across substrates ranging from 200 mm diameter wafers down to small pieces. The tool will be ideal for dopant activation while maintaining shallow junctions, thin film annealing, silicide formation, and oxidation.

For additional information please contact Jerry Bowser, 301-975-8187, jerry.bowser@nist.gov.


Acid Fume Hood — Coming Spring 2015

The CNST plans to purchase a new acid wet bench which will arrive in spring 2015 and replace the existing general purpose acid bench in cleanroom. The bench will support three simultaneous users and each position will be equipped with an electronic timer, integrated stirring hot plate, sink, glove rinse, nitrogen gun, aspirator, deionized water spray and work surface capable of handling substrates ranging from 200 mm diameter wafers down to small pieces.

For additional information please contact Vince Luciani, 301-975-2886, vincent.luciani@nist.gov


FEI Helios FIB Upgrades – Coming Fall 2015

The CNST NanoFab plans to add new capabilities to the Helios 650 DualBeam microscopes including two new types of electron detectors and a multiple gas injection system. The new detectors will allow the capture and differentiation of low-loss and no-loss backscatter electrons (BSE), which are important for discriminating between materials of very similar composition, including composites. The new detectors can be used with the current detectors, enabling simultaneous secondary electron and BSE imaging. The multiple gas injection system adds precise control of gas flow, gas needle location, and gas mixing capabilities to the current direct beam-induced deposition systems.

For additional information please contact Joshua Schumacher, 301-975-8065, joshua.schumacher@nist.gov


Silane Vapor Deposition Tool – Coming Fall 2015

The CNST NanoFab plans to purchase a silane vapor deposition tool use in the soft lithography laboratory and should be available to users in fall 2015. The silane vapor deposition tool will be capable of depositing a monolayer of silane based chemicals on the surface of a PDMS master to prevent adhesion between the PDMS and the master.  This tool is recommended for applications related to thin film casting, high aspect ratio features fabrication and other highly intricate and delicate masters.  A dedicated silanization tool will provide safe operation for users and prevent exposure to the hazard material. The tool will support substrates ranging from 150 mm down to small pieces. 

For additional information please contact Jessie Zhang, 301-975-4565, chen.zhang@nist.gov.


PDMS Mixing Tool – Coming Summer 2015

The CNST NanoFab plans to purchase a PDMS mixing tool for use in the soft lithography laboratory and should be available to users in summer 2015. The mixer will provide rapid and thorough mixing of the PDMS components with precise speed control thus producing more repeatable films. 

For additional information please contact Robert Newby, 301-975-6070, robert.newby@nist.gov.


PDMS Puncher – Coming Summer 2015

The CNST NanoFab plans to purchase a PDMS puncher for use in the soft lithography laboratory and should be available in summer 2015. The puncher, when setup together with a microscope will provide precise arrays of holes in PDMS films for multilayer microfluidics device development and fabrication. 

For additional information please contact Robert Newby, 301-975-6070, robert.newby@nist.gov.


Acid and Solvent Wet Benches – Coming Summer 2016 

The CNST plans to purchase new acid and solvent wet benches which will replace the existing general purpose benches in cleanroom. Each new bench will support three simultaneous users equipped with an electronic timer, integrated stirring hot plate, sink, glove rinse, nitrogen gun, aspirator, deionized water spray and work surface capable of handling substrates ranging from 200 mm diameter wafers down to small pieces.

For additional information please contact Vince Luciani, 301-975-2886, vincent.luciani@nist.gov


Spin Rinse Dryers and Quick Change Rotors – Coming Fall 2015

The CNST NanoFab plans to purchase a new double stack spin rinse dryer and upgrade its existing spin rinse dryers to include quick change rotors.  The additional spin rinse dryer will increase capacity in the Photolithography area and provide automated rinsing and drying of substrates ranging from 200 mm wafers down to 50 mm wafers as well as 125 mm and 150 mm photo masks.  The quick change rotor upgrade will allow users to quickly and easily configure each spin rinse dryer for their substrate size including 200 mm wafers, 150 mm wafers, 100 mm wafers, 75 mm wafers, 50 mm wafers, 150 mm photo masks, and 125 mm photo masks.  

For additional information please contact Jerry Bowser, 301-975-8187, jerry.bowser@nist.gov.