Adhesion Promoter (HMDS): YES 310TA

HMDS (hexamethyldisilzane) promotes photoresist adhesion by creating a bond between the resist and silicon.  The silizanes bond to the silicon in the wafer while the methyls bond with the photoresist.  Vapor priming allows for HMDS application in a monolayer and reduces the chance of contamination.

Quality of Coating

• Surface dehydration and subsequent vapor priming results in chemical bonding to surface hydroxyl ions, not weakly bound surface moisture
• Reesulting coatings are repeatable and stable for extended periods

Efficiency of Chemical Usage

• Uses less than 5 ml to coat up to 200 wafers
• System uses pure HMDS so there is no possibility of variation due to changes in carrier concentration

Waste Disposal

• Virtually no waste - no liquid solvents or residues to dispose of

Flexibility of Substrate Size and Shape

• Any size and shape substrate can be treated with equal efficiency up to 16"
• There are no issues with flow effects or substrate topology due to use of vapor

Flexibility of Type of Substrate

• Delicate or difficult substrates can be accommodated with simple temperature or recipie changes
• With no substrate movement during priming, there is no risk of breakage or other damage

HMDS is stored in the system under vacuum

• Chemical does not degrade from exposure to moisture in the air
• Operators are not exposed to fumes from the HMDS or carrier solvent