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Silicon Bulk Etch: Xactix Xetch e1 Series XeF2

Description:

CORAL Name:  XeF2 Silicon Etcher

This system uses Xenon difluoride vapor to etch silicon

Specifications / Capabilities:

  • Pieces up to 6" wafers
  • Silicon substrates allowed
  • All other materials must be approved
  • Glass and Silicon Substrates allowed

Scientific Opportunities / Applications:

  • Almost infinite selectivity of Silicon to photoresist, silicon dioxide, silicon nitride, and Aluminum
  • Utilizes Xenon Difluoride (XeF2) in vapor phase

Access Information:

Access to this tool requires that you have attended NanoFab safety orientation, passed the safety test, and have been properly trained on the tool. If you have any questions, please contact the NanoFab User Coordinator, or the tool contact person.

NANOFAB USER MANUAL

SCHEDULE TRAINING

xef2_etcher

Operating Schedule:

Access to this machine follows standard NanoFab operating hours (7am - 7pm Monday - Friday).  Out of hours access requires prior approval by the NanoFab Manager.

Contact

Name: Lei Chen
Phone: 301.975.2908
Email: nanofab_dryetch@nist.gov
Address:
100 Bureau Drive, Stop 6201
Gaithersburg, MD 20899-6201