CORAL Name: Wafer Bonder
The new Suss wafer bonder works in conjunction with the Suss MA6 mask aligner
Specifications / Capabilities:
- Capable of 3", 4" and 6" wafer bonding
- Can use various substrate materials depending on bonding application
- User friendly Windows-based system
- There are several types of bonding capabilities available: Thermal Compression, Anodic, Eutectic, Glass Frit, Fusion, SOI, Adhesive, and Temporary
Access to this tool requires that you have attended NanoFab safety orientation, passed the safety test, and have been properly trained on the tool. If you have any questions, please contact the NanoFab User Coordinator, or the tool contact person.
Access to this machine follows standard NanoFab operating hours (7am - 7pm Monday - Friday). Out of hours access requires prior approval by the NanoFab Manager.