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Suss SB6e

Description:

CORAL Name:  Wafer Bonder

The new Suss wafer bonder works in conjunction with the Suss MA6 mask aligner

Specifications / Capabilities:

  • Capable of 3", 4" and 6" wafer bonding
  • Can use various substrate materials depending on bonding application
  • User friendly Windows-based system
  • There are several types of bonding capabilities available: Thermal Compression, Anodic, Eutectic, Glass Frit, Fusion, SOI, Adhesive, and Temporary

Access Information:

Access to this tool requires that you have attended NanoFab safety orientation, passed the safety test, and have been properly trained on the tool. If you have any questions, please contact the NanoFab User Coordinator, or the tool contact person.

SCHEDULE TRAINING

Suss SB6e

Operating Schedule:

Access to this machine follows standard NanoFab operating hours (7am - 7pm Monday - Friday).  Out of hours access requires prior approval by the NanoFab Manager.

Contact

Name: Chet Knurek
Phone: 301.975.2515
Email: nanofab_litho@nist.gov
Address:
100 Bureau Drive, Stop 6201
Gaithersburg, MD 20899-6201