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NanoFab Tool and Processing Rates

Effective 6/1/11

The NanoFab rates are based on the actual costs of operating each tool and process.  Reduced rates are available only for non-proprietary projects that advance the CNST mission to support the development of nanotechnology from discovery to production.  For such projects, the CNST shares the associated NanoFab costs, directly contributing from the CNST research budget the difference between the reduced rates charged to the user and the full cost recovery rates.  See the User Information links for additional information on access, application, and payment policies.

Tool

Full Rate ($/hr)

Reduced Rate ($/hr)

Cleanroom Occupancy Rate 62 31
Includes Wet Chemistry, Metrology Equipment (Ellipsometer, Reflectometer, Profilometer, Optical Microscope, 4-Point Probe)
Processing Services 137 137
Does not include base NanoFab use or Specific Tool fees
Specific Tools
Wafer Bonder 184 74
Dicing Saw 116 47
Wire Bonder 145 58
Critical Point Dryer 128 51
CMOS Dry Ox 182 73
CMOS Wet Ox 182 73
Boron Doping (P-type) 94 38
Phos. Doping (N-type) 94 38
Gen. Dry Ox 94 38
Gen. Wet Ox 94 38
Anneal 94 38
Sinter 94 38
RTA 194 78
JEOL E-beam 940 376
Vistec E-beam 1174 470
Laser Writer 160 64
Nano-imprinter 164 66
ZEISS FESEM 157 63
ZEISS FIB 318 127
FEI FIB 1 420 168
FEI FIB 2 420 168
AFM 1 155 62
AFM 2 155 62
Unaxis Deep Si Etcher 160 64
Unaxis ICP Etcher 224 89
Oxford Etcher 1 160 64
Oxford Etcher 2 160 64
Unaxis RIE 1 141 56
Unaxis RIE 2 141 56
XeF2 Silicon Etcher 141 56
Microwave Asher 93 37
E-Beam Evap 1 157 63
Sputter 1 157 63
Sputter 2 157 63
PECVD 166 66
Poly LPCVD 165 66
SiN LPCVD 160 64
LTO LPCVD 160 64
E-Beam Evap 2 173 69
Atomic Layer Deposition 128 51
Parylene Deposition 103 41
Suss MA6 69 28
Suss MA8 69 28
TEM TBD TBD