TY  - CONF
AU  - Birringer, Ryan
AU  - Shaviv, Roey
AU  - Mountsier, Thomas
AU  - Reid, Jon
AU  - Zhou, Jian
AU  - Geiss, Roy
AU  - Read, David
AU  - Dauskardt, Reinhold
C2  - Advanced Metallization Conference Proceedings 2009, Baltimore, MD, US
DA  - 2009-10-13 00:10:00
LA  - en
PB  - Advanced Metallization Conference Proceedings 2009, Baltimore, MD, US
PY  - 2009
TI  - Adhesion, Copper Voiding, and Debonding Kinetics of Copper/Dielectric Diffusion Barrier Films
ER  -