TY  - JOUR
AU  - Shulver, Byron
AU  - Bunting, Andrew
AU  - Gundlach, Alan
AU  - Haworth, Les
AU  - Ross, Alan
AU  - Smith, Stewart
AU  - Snell, Anthony
AU  - Stevenson, J.
AU  - Walton, Anthony
AU  - Allen, Richard
AU  - Cresswell, Michael
C2  - IEEE Transactions on Semiconductor Manufacturing
DA  - 2008-11-03 00:11:00
LA  - en
M1  - 21
PB  - IEEE Transactions on Semiconductor Manufacturing
PY  - 2008
TI  - Extraction of Sheet Resistance and Line Width from All-Copper ECD Test Structures Fabricated from Silicon Preforms
UR  - https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=32758
ER  -