TY  - CONF
AU  - Robert Keller
AU  - Roy Geiss
AU  - Yi-Wen Cheng
AU  - David Read
C2  - Materials, Technology, and Reliability of Advanced Interconnects, San Francisco, CA, USA
DA  - 2005-04-01 00:04:00
LA  - en
M1  - 863
PB  - Materials, Technology, and Reliability of Advanced Interconnects, San Francisco, CA, USA
PY  - 2005
TI  - Microstructure Evolution during Electric Current Induced Thermomechanical Fatigue of Interconnects
UR  - https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=50148
ER  -