TY  - JOUR
AU  - Robert Keller
AU  - David Read
AU  - Roey Shaviv
AU  - Greg Harm
AU  - Sangita Kumari
C2  - Microelectronic Engineering
DA  - 2011-05-15
LA  - en
PB  - Microelectronic Engineering
PY  - 2011
TI  - Electromigration of Cu Interconnects Under AC and DC Test Conditions
ER  -