TY  - JOUR
AU  - Chukwudi Okoro
AU  - James Marro
AU  - Yaw Obeng
AU  - Kathleen Richardson
C2  - Microelectronics Reliability
DA  - 2014-06-14
LA  - en
PB  - Microelectronics Reliability
PY  - 2014
TI  - Defect and Microstructural Evolution in Thermally Cycled Cu Through-Silicon Vias
UR  - https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=915535
ER  -