@conference{772201,
  author = {Robert Keller and Roy Geiss and Yi-Wen Cheng and David Read},
  title = {Microstructure Evolution during Electric Current Induced Thermomechanical Fatigue of Interconnects},
  year = {2005},
  number = {863},
  month = {2005-04-01 00:04:00},
  publisher = {Materials, Technology, and Reliability of Advanced Interconnects, San Francisco, CA, USA},
  url = {https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=50148},
  language = {en},
}