@article{38376,
  author = {Robert Keller and David Read and Roey Shaviv and Greg Harm and Sangita Kumari},
  title = {Electromigration of Cu Interconnects Under AC and DC Test Conditions},
  year = {2011},
  month = {2011-05-15},
  publisher = {Microelectronic Engineering},
  language = {en},
}